DIP ku-inthanethi i-AOI TY-D500
Ukuhlolwa kwe-inthanethi kulayini wejubane eliphezulu
●Ukweqa umugqa wokukhiqiza, akukho ukunqamuka komugqa.
●Isakhiwo se-modular, kulula ukuyifaka nokuhambisa.
●Sekela kokubili umzila wesitimela oholayo nolayini webhande.
●Sekela ukuhlolwa okuqhubekayo kwamabhodi okuphakelayo ngaphandle kokuphazamiseka.
●Umphumela wokuhlola ugcinwe futhi ufinyezwe ku-SPC, ngohlelo olushaqisayo lwezwi elizenzakalelayo.
●Umthombo wokukhanya okabili phezulu nangaphezulu.
●Izinto zokuhlola: okungalungile/okulahlekile/okuhlanganisiwe kwezingxenye, ibhakhodi, ukuhlolwa kokupakisha, njll.
●Umthelela ohlanganisiwe wekhamera, ilensi nomthombo wokukhanya.
●Ikhamera ye-pixel eyizigidi ezingama-20.
| Buka sekukonke i-DIP ku-inthanethi i-AOI TY-D500 | ||
| Uhlelo lokuhlola | Isicelo | Ngaphambi/okuthunyelwe kwe-DIP wave soldering |
| Imodi yohlelo | Ukuhlela ngokuzenzela, ukuhlela okuzenzakalelayo, ukungenisa idatha ye-CAD, ukuhlela ungaxhunyiwe ku-inthanethi | |
| Izinto Zokuhlola | I-DIP: Izingxenye ezingekho, izingxenye zomonakalo, i-offset, i-skew, i-inversion, njll | |
| Indlela Yekubala | Ukufanisa isifanekiso, ukubalwa kombala, ukukhipha umbala, ukusebenza kwesikali esimpunga, ukungafani kwesithombe, i-OCV | |
| Imodi yokuhlola | Ilensi eyodwa imboza yonke i-PCBA ukuze ihlolwe, isivinini esisheshayo, isekele ukutholwa okuqhubekayo ngaphandle kokumiswa, isekela ukuhlolwa kwebhodi elihlanganisayo kanye namamaki amaningi, ukusekela ibhodi ehlukahlukene kulayini ofanayo, nomsebenzi wophawu olubi. | |
| Isibonisi somphumela | Ukusekelwa kwe-inthanethi amabhodi angu-20 anemiphumela yokuboniswa kwenqolobane, isibonisi se-plug-in sesizindalwazi sokusekela, umphumela we-NG wokusakaza ngezwi. | |
| Umsebenzi wezibalo we-SPC | Rekhoda ngokugcwele idatha yokuhlola futhi wenze ukuhlaziya,, ngokuguquguquka okuphezulu ukuze uhlole ukukhiqizwa kanye nesimo sekhwalithi.Isithombe esihloliwe nedatha kulondolozwe ngokuhambisana nenombolo ye-serial. | |
| I-engeli yengxenye | Sekela ukuzungezisa okungu-0～359°, ibanga elincane elingu-angular 1° | |
| Ingxenye encane | 1 mm | |
| Isistimu ye-Optical
| Ikhamera | Ikhamera yedijithali yezimboni enesivinini esiphezulu i-20million pix camera, isekela ukudubula okuqhubekayo |
| Ukulungiswa kwelensi | 60um - 100um, kuye ngosayizi we-PCB | |
| umthombo wokukhanyisa | Ibhodi yokukhanyisa ye-LED ephezulu nangaseceleni | |
| Isistimu yekhompyutha | CPU | Intel i7 noma izinga elifanayo |
| RAM | 8GB | |
| I-SSD | 128GB | |
| OS | Win7 64bit | |
| Gada | 22 intshi, 16:10 | |
| Uhlelo lwemishini | Imodi yokunyakaza nokuhlola | Ibhodi le-PCB elihambayo lilawulwa umugqa wokukhiqiza wamakhasimende.Ukusekela umzila wesitimela nomugqa webhande, ukulungiswa okuzenzakalelayo kokuchema kanye ne-engeli nge-pcb mark positioning. |
| Ubukhulu be-PCB | ～500*500mm(Max), kungenziwa egcizelele | |
| Isivinini somugqa wokukhiqiza | Ubukhulu: 3.5m/min | |
| Ukugoba kwe-PCB | ＜5mm, noma 3% we-PCB Diagonal ubude | |
| Ubude bengxenye ye-PCB | 50mm, iyaguquguquka, kungenziwa egcizelele isisekelo isidingo | |
| Imingcele evamile | Ubukhulu bomshini | L710mm * W600mm * H700 mm，ubude akubandakanyi ukukhanya kwesignali |
| Amandla | I-AC220V, 50/60Hz, 1.0KW | |
| Ukuphakama kwe-PCB kusuka emhlabathini | Akunqunyelwe, i-AOI isebenza ngokuqondile kulayini wokukhiqiza | |
| Isisindo somshini | 90KG | |
| Izinga lokuphepha | Izinga lokuphepha le-CE | |
| Izinga lokushisa kwendawo kanye nomswakama | 10–35℃, 35–80％ RH (ayifinyeleli)
| |
| Ukucushwa ongakukhetha | Isiteshi sokunakekela, uhlelo lokuhlela olungaxhunyiwe ku-inthanethi, i-SPC servo, uhlelo lwekhodi yebha |
