SMT (surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of broad range of electronic components, like capacitors, resistors, integrated circuits onto the PCBs which are in turn used in computers, consumer electronics as well as industrial, medical, automotive, military and telecommunications equipment. Similar equipment exists for through hole components.This type of equipment is sometimes also used to package microchips using the flip chip method.
BGA (Ball Grid Array) Board Assembly Process
SMT Assembly Company has been providing BGA assembly, including BGA Rework and BGA Reballing services in the Printed Circuit Board Assembly industry since 2003. With state-of-the-art BGA placement equipment, high-precision BGA assembly processes, cutting-edge X-Ray Inspection equipment, and highly customizable Complete PCB Assembly solutions, you can rely on us to build high quality and high yield BGA boards
PCB Wave Soldering
One of the techniques that has been used in PCB assembly is wave soldering as it provides swift soldering for boards using either or both SMT and leaded devices.
Wave soldering is a technique used for large scale PCB assembly for fast soldering of boards that use either or both SMDs and leaded components.
Wave soldering is far less widely used in PCB assembly than it was in previous years. Despite this, wave soldering remains as a process which can be used effectively in a number of areas, especially when the PCB assembly uses a mix of leaded and SMT components.
LED flip chip refers to the chip that can be directly bonded with ceramic substrate without welding wire. We call it DA chip. It is different from flip chip which still needs welding wire when flip chip is transferred to silicon or other material substrates in the early stage. Compared with traditional forward chip, traditional flip chip which is bonded by metal wire faces up while flip crystal is connected with substrate. The electrical side of the chip is down, which is equivalent to turning over the traditional chip.