Umhlinzeki Wesixazululo Sochwepheshe we-SMT

Xazulula noma yimiphi imibuzo onayo nge-SMT
isibhengezo_sekhanda

I-Automatic BGA Rework Station Hot Thengisa Isiteshi se-BGA Ngokuqondana kwe-Optical TY-2860C

Incazelo emfushane:

Isiteshi esisha se-BGA sokusebenza kabusha sase-China Esinenani Elihle

Usayizi we-PCB: Max 410*370 mm Ubuncane 20*20 mm

I-chip ye-BGA: L630*W610*H690 mm

Isisindo: 48 kg


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Isici

Izifudumezi ezizimele ezi-3

① Izifudumezi eziphezulu nezingaphansi ziwukushisa komoya oshisayo, i-IR yesithathu(indawo yokushisa350x260mm)ukufudumeza kwe-infrared, ukunemba kwezinga lokushisa ngaphakathi ±3, ama-heaters aphezulu naphansiukubeka 6 amasegimenti izinga lokushisa elikhulayo kanye 6 izingxenye lokushisa umsebenzi, kungagcina amaqembu 50 lokushisa Curves for ezahlukene BGA chips.

it ingafudumeza i-PCBibhodi kanyeBga chips ngesikhathi esifanayo.Futhi i-heater yesithathu ye-IR canukushisa kuqala ibhodi le-PCB kusuka phansi, ukuze ugweme i-PCB ekuguqukeni phakathi nenqubo yokulungisa.Iama-heaters aphezulu naphansi ashisa ngokuzimela;

③ ukusetshenziswa kwamandla kwe-heater yesithathu ye-IR kungalungiswa, yenze ibhodi le-PCB lishise ngokulinganayoly, gwemaPCB kusukaukuguquguquka.

④ Inzwa yangaphandle ingakwazi ukubona izinga lokushisa ngokunembile, ihlaziye futhi ilinganise ijika langempela lokushisa ngokunembilenganoma yisiphi isikhathi.

Mi-ulti-functionali-hommization uhlelo

① I-AdoptI-Taiwanisixhumi esibonakalayo somshini womuntu, i-thermocouple yohlobo lwe-K enembayo ephezulu evalekile-isilawuli se-loop, izinga lokushisa eliboniswa esikrinini sokuthinta, i-heater ephezulu ingahanjiswa ngokukhululekile;heater phansi canbe lungisaed phezulu naphansi.

② Yamukelwa yonke inhlobosama-nozzles e-BGA, nge360° ukuzungezisa, kululaokwefakai-ationfuthi esikhundleniingqondo, okwenziwe ngezifiso kuyatholakala;

③ Kukhona ishalofu lokusekela le-BGA lokunamathiselaukusekelaPCBibhodi;

④ Multi-functionalIshalofu lokusekela le-PCB, lingahambadeduze kwe-X eksisi,ngengokushesha futhi kulula ukuma kwebhodi le-PCB, ilungele lonke uhlobo lwesikhundla se-PCB;

⑤ I-cross-flow fan enamandla ipholisa ibhodi le-PCBngokusheshangemva desoldering futhi soldering, kungaba ukuvimbela ibhodi PCBkusukaukuguquguquka;ngeiphampu ye-vacuum kanye nepeni lokudonsa le-vacuum langaphandleto thatha ama-chipskahle.

Imisebenzi yokuphepha ephezulu

WithiIsitifiketi se-CE;ngemva kokudilizwa kanye ne-soldering, kukhona okwethusayo.lapho izinga lokushisa liphuma ekulawuleni;isekethe izocisha ngokuzenzakalelayo, iphindwe kabilingaphezulu-umsebenzi wokuvikela izinga lokushisa.Ipharamitha yezinga lokushisa inephasiwedi okufanele igwenywekusukaizinguquko ezingahleliwe, ezinemisebenzi ephakeme yokuvikela ephephile, zingavikela i-PCBibhodiizingxenye kanye nomshini ekulimaleni kunoma yisiphi isimo esingavamile.

Ikhamera

2 million pixels

Ukwahlukaniswa Komkhiqizo Ikhamera ye-VGA

Usayizi wenzwa 1/3 intshi

Amaphikseli asebenzayo I-HD Egcwele

Isixazululo 1920*1080@30FPS

Isixhumi esibonakalayo se-VGA, i-USB2.0

Usayizi wephikseli 2.75* 2.75 μm

Ukunikezwa kwamandla DC-12V/1A

Imininingwane yesithombe

Isiteshi sokulungisa kabusha isikhwama se-TY-2860C

Imininingwane

Imodeli I-TY-2860C
amandla I-AC220V±1050/60Hz
Amandla Aphelele Ubukhulu 4800 W
Amandla heater iheater ephezulu 800W iheater engezansi 1200W IR heater 2700W
Izinto zikagesi Isikrini sokuthintaUkunemba okuphezulu kwe-intelligent Imodyuli yokulawula izinga lokushisa
Ukulawula izinga lokushisa I-thermocouple yohlobo lwe-K (Iluphu evaliwe)
Ukuma I-V-groove, ukwesekwa kwe-PCB
Usayizi we-PCB Ubukhulu 410*370 mm Amaminithi angu-20*20 mm
I-chip ye-BGA L630*W610*H690 mm
Wayisishiyagalombili 48kg

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