I-SMT Automatic Lead Free Wave Soldering Machine T350

1. Idizayini yombhobho wokonga amandla kanye neyonga ithini: ububanzi bomlomo owonga ithini bungalungiswa ngokuvumelana nobubanzi be-PCB, ukuze kuzuzwe umphumela wokulondoloza ithini.
2. Izinzipho ze-Titanium nendawo yokushisa ngaphambili: Izinzipho zensimbi ye-Titanium alloy, akulula ukuthi zigogeke, ziqinile, ubude bendawo yokushisa kwe-infrared preheating.
3. Isithando somlilo esisha sikathayela esine-anti-oxidation sihlala isikhathi eside ekusebenzeni kwezinga lokushisa eliphezulu.
4. Idizayini eyenziwe ngumuntu: ibhokisi lokushisisa komoya eligcwele elidonsekayo.
5. Ukubukeka: Isithando somlilo sangaphakathi sonke senziwe ngensimbi ecolisisiwe ukuze siqine.
6. I-preheating system ifaneleka ku-lead-free kanye nezidingo ezihlukahlukene zenqubo: ibhokisi lokushisa lishiswa ngomoya oshisayo we-turbocharged, futhi ukushisa kufinyelela ezinyaweni zengxenye ye-PCB ngokukhululekile nangokulinganayo.Ngeke kube khona ubuhlalu be-tin kanye ne-flux eyomisiwe emoyeni oshisayo oshisayo oshisayo, umoya oshisayo ufana kakhulu ne-BGA, izibani zokushisa ukushisa ziyizingxenye ezinkulu ezibamba ukushisa.
7. Uhlelo lokufutha luyonga kakhulu futhi luhambisana nemvelo: idivayisi ye-rodless cylinder spray ingalungisa ngokuzenzakalelayo nobubanzi be-PCB ukuze isindise ngempumelelo ukugeleza.Idivayisi ehlukanisiwe, imfucumfucu iyaphela emiseleni ekhethekile yokukhipha neyokubuyisela, ehlangabezana nezidingo zokuvikela imvelo.