I-DIP Solder Machine Dual Wave Soldering Machine Ye-PCB TYtech-T300

ISINGENISO:

1. Ukonga amandla, uhlelo lokusebenza olungenamthofu, luhlangabezana nemfuneko yokuvikelwa kwemvelo kanye nomklamo osebenziseka kalula

2. Isistimu yamandla ezenzakalelayo, isilawuli se-inverter, isici sebhodi esizenzakalelayo sokulayisha.

3. Isifutho se-Flux sisebenzisa i-nozzle ye-spray yaseJapane eguquguqukayo nokushayela nge-stepper motor, uhla lwesifutho luyakhetha, i-PLC ilawulwa, inembile futhi inokwethenjelwa.

4. Umklamo wekhabethe lesitsha se-Flux, kulula ukuwuhlanza.

5. I-Conveyor ihlome ngezikulufo eziguquguqukayo ezinobubanzi obu-3, ukudluliswa kwe-conveyor kuzinzile, ayikho ingozi yokuwa kwe-PCB.

6. Iminwe ye-Titanium solder, i-v-groove eqinile eqinile ephindwe kabili enokumelana nethini

7. Iluphu ye-PID evala iluphu elawulwa ama-pre-heaters omoya oshisayo, isistimu yokushisa ngaphambi kwesikhathi isebenzisa ukulawulwa kwezinga lokushisa okuthathu okuzimele ukuze kuqinisekiswe ukulondolozwa kokushisa okuhle kakhulu, ukufana kwezinga lokushisa, ukunemba kwezinga lokushisa ku-±2ºC.

8. Umklamo we-modular wangaphambi kokushisa, ukuvikelwa kwemvelo nokuphepha, okulungele ukuhlanzwa.

9. I-Solder motor isebenzisa imoto yokuguqula imvamisa ephezulu engenisiwe enokulawula okuzimele, ukusebenza okuzinzile.

8. Izinto zokupholisa ebhodweni le-solder ziyinsimbi, ayikaze igle, ibhodwe le-solder elinejakhethi ye-oxidation, amanyela aphansi

11. Isici sokuqalisa isibali sikhathi sebhodwe le-solder, i-solder incibilika phakathi nemizuzu engu-90.

12. Umshini wokuhlanza umunwe ozenzakalelayo uhlomile.

13. Ngomsebenzi wenkumbulo yebhokisi elimnyama, umshini ungahlala ugcina idatha ye-SPC, uthuthukise ukusebenza kahle komsebenzi.

14. Ukuqapha okuhlakaniphile nohlelo lwe-alamu kuqinisekisa ukusebenza okuzinzile nokuphepha kwabaqhubi.