Uphawu
I-HELLER 1089MK7 Reflow Soldering Oven
● Ubude be-oveni yokubuyisela kwakhona yi-465cm (183'').
● Ukhetho lweGesi yeNkqubo: Umoya kunye neNitrojeni.
● Indawo yokufudumeza: phezulu 9/Ezantsi 9
● Ubukhulu bePCB Ububanzi: 55.9cm (22”)
● Ukusebenzisa uyilo lwamva nje lwekhava esezantsi, ubushushu bomphezulu bomatshini buphantsi, ukukhuselwa kwendalo kunye nokonga amandla
● Imodyuli entsha yokufudumeza, enokunciphisa ukusetyenziswa kwenitrogen ukuya kuthi ga kwi-40%
● Inkqubo yokubuyisela i-innovative flux, kulula ukuyibuyisela kunye nokucoca
● Iguquguquka kakhulu kwithambeka lokuhla, imodyuli entsha enamandla yokupholisa umoya obandayo inokubonelela ngesantya sokupholisa esingaphezulu kwe-3 degrees ngomzuzwana.
● HELLER isoftware yolawulo lwamandla kuphela
● Isoftware ye-CPK edibeneyo yasimahla, ulawulo lwedatha yamanqanaba amathathu
● Iyahambelana ne-Industry 4.0
Umfanekiso weenkcukacha
Iinkcukacha
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| 1809MK7(Umoya) | 1809MK7(Nitrogen) | |
| Ubonelelo loMbane |
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| Igalelo laMandla (iSigaba sesi-3) esiMgangatho | 480 volts | 480 volts |
| Ubungakanani bebreaker | 100 amps @ 480v | 100 amps @ 480v |
| kW | 8.5 - 16 Ngokuqhubekayo | 7.5 - 16 Ngokuqhubekayo |
| Ubaleko oluqhelekileyo lwangoku | 25- 35 amps @ 480v | 25- 35 amps @ 480v |
| Iingeniso zaMandla aziKhethekileyo ziyafumaneka | 208/240/380/400/415/440/480I-VAC | 208/240/380/400/415/440/480I-VAC |
| Ukuphindaphinda | 50/60 Hz | 50/60 Hz |
| Indawo yolandelelwano Vula | S | S |
| Imilinganiselo |
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| Imilinganiselo ye-oveni iyonke | 183" (465cm) L x60” (152cm) W x 57” (144cm) H | 183" (465cm) L x60” (152cm) W x 57” (144cm) H |
| Ubunzima obububo obuqhelekileyo | 4343lbs.(1970kg) | 4550 lbs.(2060kg) |
| Ubunzima boKuthumela ngeNqanaba | 5335lbs.(2420kg) | 5556lbs.(2520kg) |
| Umyinge woThutho oluQhelekileyo | 495 x 185 x 185 cm | 495 x 185 x 185 cm |
| Ulawulo lweKhompyutha |
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| AMD okanye Intel esekwe kwikhompyuter | S | S |
| Flat Screen Monitor w/Mount | S | S |
| Inkqubo yokuSebenza yeWindows | IiWindows10Ò Ekhaya | IiWindows10Ò Ekhaya |
| Auto Start Software | S | S |
| UkuLonwa kwedatha | S | S |
| Ukhuseleko Lwegama Lokugqithisa | S | S |
| LAN Networking | O | O |
| Umoya Ongangeni |
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| Ubuncinci bePPM Oksijini | - | 10-25 PPM* |
| Ukupholisa okungenamanzi w / Flux Ukwahlula iNkqubo | - | O |
| I-Nitrogen kwi-Valve / yokuvala | - | O |
| Inkqubo yokuJonga iOxygen | - | O |
| Inkqubo yokulinda yeNitrojeni | - | O |
| Ukusetyenziswa okuqhelekileyo kweNitrojeni | - | 500 - 700 SCFH ** |
| Iimpawu ezongezelelweyo | ||
| Isoftware yeProfayili ye-KIC | S | S |
| Umqondiso we Tower Light | S | S |
| UkuPhakanyiswa kweHood eneMmandla | S | S |
| Ezintlanu (5)Ingxelo yeThermocouple | S | S |
| IiSensors zeAlarm ezingafunekiyo | O | O |
| Intelligent Exhaust System | O | O |
| KIC Profiler / ECD Profiler | O | O |
| Inkxaso yeBhodi yeZiko | O | O |
| Isivamvo sokuLahla iBhodi | O | O |
| Counter yebhodi | O | O |
| Bar Code Reader | O | O |
| Ipeyinti eSiko kunye neDecal | O | O |
| IBattery Backup yeConveyor kunye nePC | O | O |
| I-GEM/SECS Interfacing | O | O |
