Feature
1.Dual Inspection Capabilities: Combines optical inspection (for ICs, diodes, resistors) and electrical testing (for resistance, capacitance, inductance) to detect BOM errors, missing/wrong parts, reverse polarity, and component performance issues.
2.High Efficiency & Labor Savings: 1 person completes inspections (replacing 2 workers), with at least double the speed of traditional manual testing—saving up to 42,000 yuan/month for 8 SMT lines.
3.User-Friendly & Flexible Operation: Supports one-click import of BOM/XY coordinates (double-sided compatible), auto-recognizes component specs, and features dual-graph display for real-time physical/position comparison.
4.Reliable Traceability & Protection: Auto-generates unalterable test reports, supports MES integration, and has power-off protection to resume inspections from the interrupted point.
5.Advanced AI & Precision: AI-driven automatic PASS/FAIL judgment with audio-visual alerts, 600–4800 DPI HD scanning, and LCR bridge with 0.05% basic precision for accurate measurements.
Detail Image
Specifications
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Model:TY-FAI980 |
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Item
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Detailed parameters |
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Circuit board detected
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Circuit board in front of the SMT furnace (solder paste board, paste board and
red gum board)
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Detection method |
Visual inspection of air paste position
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As for resistance, capacitance and inductance, the LCR bridge measurement is
used
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As for IC and audion, the automatic optical character checking is used.
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The diode polarity can be distinguished and LED can be turned on
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The average detection speed is 3s/element in accordance with the operator's proficiency, and the solder paste board is slow
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Scanner
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Professional HD linear CCD scanner
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The highest definition: 600DPI~4800DPl
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The average scanning speed is 30s/PCS based on the PCBA size
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LCR bridge
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Test frequency: 20Hz~300KHz
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Minimum measurement of R/C, R: 0.05Ω: C: 0.1pF
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Basic precision: 0.05%
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Measuring display scope: R: 0.01m ohms-99.9999M ohms L: 0.01nH~9999.9H C:
0.00001pF~9.9999F The testing software automatically controls the selection of measuring gear and parameters
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Programming mode
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Quickly importing BOM form and XY coordinates as well as matching with the scanning pattern
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Automatically extracting the element specification information from material description
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Programming mode
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Supporting two-sided coordinate import and selecting one side for detection
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Automatically identifying and marking the air paste position
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Interception by the box for optical character detection
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Type covered by the detection
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Data: BOM dosage error, position repetition, no definition of XY coordinates and multiple
definitions
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Circuit board: Excessive pasting, missing parts, wrong parts, reverse direction, rollover, excursion and rotation
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SPC process control
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The test data is recorded in the whole process and the Excel and PDF reports can be output
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The test scenarios can be restored in the later period and the traceability basis is provided
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Server mode
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The central data base is used and the centralized and unified management for the data of multiple FAI data can be conducted
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Inspection result display
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23 inches of LCD and OK/NG sound and light hint
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PCB size range
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Maximum: 420mm x 310mm (the larger size shall be customized) |
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PCB± lower clear height
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PCB upper part: 28mm PCB lower part 50mm |
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Voltage and power
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AC220V 50/60HZ less than 1.5KVA |
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Equipment weight
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About 230KG |
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Boundary dimension
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1160mm x 800mm x 1100mm (W*D*H)
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Ambient temperature
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10~35°C
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Humidity
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35 -80% (no moisture condensation)
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Equipment safety specification
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Compliance with CE safety standards
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