Feature
Ultimate Solution for Inspection Challenges
▪ Circuit boards are becoming more complex with new products. An AOI machine is
becoming even more crucial to the electronics manufacturing lines. The industry has
many 2D, 2.5D and pseudo-3D inspection options that only compound issues with
false calls and escapes. The Zenith AOI Series is the only machine that delivers True
3D Inspection to address solutions caused by highly specular packages and shadows
from adjacent parts.
Incomparable True 3D Inspection Performance
▪ The Zenith AOI Series is the only solution in the industry to base its inspection criteria according to IPC-610 standards for electronic assembly acceptability requirements. It provides clear and concise AOI measurements to accurately identify multiple defects. Because it uses a quantitative True 3D measurement-based approach, the system delivers exceptional accuracy and repeatability.
▪ True 3D Inspection Performance :
Missing Solder, Offset, Polarity, Upside Down, OCV/OCR, Solder Fillet,
Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging, and more.
IPC-based Solder Joint Inspection
▪ Through Koh Youngs’s proprietary vision algorithms, the Zenith series can quantify the exact height of a solder joint. Despite shadows or interreflection challenges, the Zenith accurately inspects and measures according to IPC-610 standards for electronic assembly acceptability requirements.
AI-powered Auto Programming (KAP)
Industry-leading 3D profilometry technology converges with Koh Young’s proprietary AI technology to deliver true automatic programming. The innovative geometry-based Koh Young Auto Programming (KAP) software solution reduces the programming process to minimizes time to production and reduces costs.
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Specifications
