Feature
1.Dual 2D/3D Inspection: Combines laser line scan and RGB LED lighting to eliminate shadows, detecting foreign materials, solder balls, and all common component defects without complex teaching.
2.High Speed & Accuracy: Equipped with a fast CMOS camera and telecentric lens, it completes inspection for 260×200mm PCBs in 10 seconds (including loading/unloading) with precise measurements.
3.User-Friendly Operation: Offers one-click component teaching, no-Gerber-data programming, and customizable UI, enabling 95%+ non-adjusted ratio and efficient setup within 70 minutes.
4.Comprehensive Process Adaptability: Supports warpage tracking (±5mm), barcode/badmark recognition, press fit inspection, and wave soldering defect detection.
5.Smart Connectivity & SPC: Integrates xNet network for remote monitoring (PC/mobile), SPC data analysis, and unified management of AOI/SPI systems.
Detail Image
Specifications
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