Feature
Key Feature:
1. Higher productivity and quality with printing, placement and inspection process integration
2. For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm
3. Higher area productivity through dual lane placement
4. Quick-change feeder carts and nozzle banks
5. Lightweight 16-nozzle head (for 77,000 CPH) with increased placement accuracy to 25um (cpk ≥ 1.0)
Detail Image
Specifications
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D3 Automatic High-Speed Dispenser for PCB Assembly







