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TY400C Inline Selective Wave Soldering Machine for Intelligent PCB Production

TY400C Inline Selective Wave Soldering Machine for Intelligent PCB Production Featured Image
  • TY400C Inline Selective Wave Soldering Machine for Intelligent PCB Production

Short Description:

TY400C integrates spray, preheat and soldering 3 stations, supports online/offline mode switching and automatic cleaning. With infrared temperature control, fast programming and auto Z‑axis correction, it fits small‑batch production and protects heat‑sensitive components perfectly.

Product Detail

Product Tags

Feature

• 3-Station: Spray + Preheat + Soldering

• Single/Double Solder Pots

• Online/Offline Mode Switching

• Board Input/Output: Left In, Right Out; Left In, Left Out

• Small footprint, suitable for small batch production

• Automatic cleaning of spray heads and solder nozzles

• All-titanium solder pots, compatible with all alloy solders

• 5-minute rapid programming, camera scanning, simple and easy to use

• Multi-point infrared temperature measurement system ensures consistent soldering temperature and protects heat-sensitive components from damage

• Zero-burden program copying; compatible with multiple machines using the same product, program can be copied and imported

• Zero-hassle solder nozzle replacement; automatic Z-axis height correction

Detail Image

1

Specifications

Model 
TY400C
Equipment parameters      
Equipment travel distance
 400*400mm
Dimensions
1400*1600*1750mm
Power supply 
380VAC/18KW 
Operating power 
2.5-2.8KW
Weight 1100kg
Transport width 
100-400mm 
Transport height
900±20mm 
Workstation parameters        
Spray control method 
 Dot spray/line spray
Preheating method Hot air + infrared
Preheating temperature
25-250℃
Wave drive method Mechanical pumps/electromagnetic pumps
Pot capacity 15kg
Maximum pot temperature 350℃
Melting time
Mechanical pump ≤ 30mins, electromagnetic pump ≤ 75mins
Fluoride capacity 
2L
Alcohol capacity 
 2L
PCB Specifications    Maximum PCB size (including fixture)
500*500mm
Height of upper PCBA components Max 100mm
Height of lower PCBA components
Max 60mm 
PCB process edge
≥5mm 
Software Configuration Programming method Panoramic images / Real-time images / Manual programming

 

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