Igama elipheleleyo le-SMT yi-Surface Mount technology.Izixhobo zeperipheral ze-SMT zibhekisa koomatshini okanye izixhobo ezisetyenziswa kwinkqubo ye-SMT.Abavelisi abahlukeneyo baqulunqa imigca yemveliso eyahlukeneyo ye-SMT ngokwamandla abo kunye nesikali kunye neemfuno zabathengi.Zinokwahlulwa zibe yimizila yemveliso ye-SMT ezenzekelayo ezenzekelayo kunye nemigca yemveliso ye-SMT ezenzekelayo.Oomatshini kunye nezixhobo azifani, kodwa izixhobo ze-SMT zilandelayo ziphelele kwaye zityebile kumgca woqwalaselo.
1.Ukulayisha umatshini: Ibhodi yePCB ibekwe kwishelufu kwaye ithunyelwe ngokuzenzekelayo kumatshini webhodi yokufunxa.
2.Umatshini wokufunxa: thatha iPCB kwaye uyibeke kwingoma kwaye uyidlulisele kumshicileli we-solder paste.
3.Umshicileli wokuncamathisela we-solder: ngokuchanekileyo vuza i-solder paste okanye ipatch glue kwiipads zePCB ukulungiselela ukubekwa kwecandelo.Oomatshini bokushicilela abasetyenziselwa i-SMT bohlulwe ngokokude babe ziindidi ezintathu: oomatshini bokushicilela abazenzelayo, oomatshini bokushicilela abazenzela ngokwabo kunye noomatshini bokushicilela abazenzekelayo.
4.SPI: I-SPI sisishunqulelo soHlolo lwe-Solder Paste.Isetyenziswa kakhulu ukubona umgangatho weebhodi ze-PCB eziprintwe ngabashicileli be-solder paste, kunye nokubona ubukhulu, ukutyeba kunye nendawo yoshicilelo lwe-solder paste yoshicilelo.
5.Mounter: Sebenzisa inkqubo ehlelwe zizixhobo ukufaka ngokuchanekileyo amacandelo kwindawo emiselweyo yebhodi yesekethe eprintiweyo.I-mounter inokwahlulwa ibe yi-high-speed-mounter kunye ne-multi-function mounter.I-high-speed mounter isetyenziselwa ukunyuswa kwezinto ezincinci ze-Chip, umatshini wokubeka osebenzayo kunye nongenamsebenzi uphakamisa amacandelo amakhulu okanye amacandelo e-heterosexual ngendlela yemiqulu, iidiski okanye iityhubhu.
6.Ukuhanjiswa kwePCBr: isixhobo sokudlulisa iibhodi zePCB.
7.Hlaziya i-oveni: Ifumaneka emva komatshini wokubeka kumgca wokuvelisa we-SMT, inika indawo yokufudumala ukunyibilikisa i-solder pads kwi-pads, ukwenzela ukuba i-surface mount components kunye ne-PCB pads zihlanganiswe ngokuqinileyo kunye ne-solder paste alloy.
8.Umkhupheli: Qokelela PCBA ngokuzenzekelayo ngokusebenzisa track transmission.
9.I-AOI: I-Automatic Optical Identification System, esisishunqulelo sesiNgesi (i-Auto Optical Inspection), ngoku isetyenziswa ngokubanzi ekuhloleni imbonakalo yemigca yendibano yebhodi yesekethe kushishino lwe-elektroniki kwaye ithatha indawo yokuhlolwa okubonakalayo kwangaphambili.Ngethuba lokufumanisa ngokuzenzekelayo, umatshini uhlola ngokuzenzekelayo i-PCB ngekhamera, uqokelela imifanekiso, kwaye uqhathanise amajoyina avavanyiweyo e-solder kunye neeparitha ezifanelekileyo kwi-database.Emva kokulungiswa komfanekiso, iziphene kwi-PCB ziyajongwa, kwaye iziphene ziyaboniswa/zimakishwe ngesiboniso sokulungiswa koMlungisi.
Ixesha lokuposa: Aug-10-2022