I-3D SPI (Ukuhlolwa Kwe-Solder Namathisela)Umshini TY-3D200
Imininingwane
| Ipharamitha yamandla okuthola izisetshenziswa | INDLELA | I-TY-3D200 Standard Monorail |
| Ubukhulu be-PCB | 0.6 ~ 5.0mm | |
| Isisindo sepuleti le-PCB | 5.0 Kg | |
| Ubude obuvumelekile be-PCB | PHEZULU: 20mm, Phansi: 25mm | |
| Ububanzi bonqenqema be-PCB | 3mm | |
| Ubude obukhulu bokunamathisela ithini | 500um | |
| Ubuncane bosayizi we-PCB | 55mm*55mm | |
| Ubukhulu besayizi ye-PCB | 400*330 | |
| Ingxenye encane eguqukayo | 01005 | |
| Uhlobo olubi lokutholwa | Ithini elincane, ukuphrinta okushodayo, isifunda esifushane, i-offset | |
| Izinto zokuhlola ezijwayelekile | Indawo, isikhundla, ukuphakama, ivolumu, isifunda esifushane | |
| Ubude bokunamathisela ithini | 0~500um | |
| Isinxephezelo sokugoba amapuleti | 5mm | |
| Umsebenzi wokwabelana wedatha ye-Bad Mark nomshini wokubeka | Ongakukhetha | |
| | Umgomo wokutholwa | Indlela yokukala Umngcele weVector yombala |
| Ibhrendi yekhamera | I-ID yesiJalimane | |
| Iphikseli yekhamera | 5M Pixel | |
| isithombe se-monochrome | Be | |
| isithombe sombala | Be | |
| ukulungiswa kwe-optical | 8μm/12μm /13.8μm/14.5μm/16.3μm | |
| FOV SIZE | 28mm/35mm/37mm/41mm | |
| Inani lemithombo yokukhanya | 6 umthombo wokukhanya | |
| Ibanga lokuthola ubude | 0-300um | |
| Isivinini sokuthola | 0.35s/FOV | |
| Isofthiwe | Ulimi lwesoftware | IsiShayina / IsiNgisi |
| Isofthiwe yokuhlela | Uhlelo olungaxhunyiwe ku-inthanethi | |
| Isikhathi sokuhlela | 5 ~ 20 imizuzu | |
| Isikhathi sokuhlela kahle uhlelo | 1 ~ 10 amaminithi | |
| Isikhathi sokushintsha ulayini | 1 ~ 10 amaminithi | |
| Imodi yokuhlela, uhlobo lokufakwayo kwedatha | I-GerberData 274D / 274X, ukuhlela isithombe sedivayisi | |
| Isoftware yokuhlela engaxhunyiwe ku-inthanethi | Ongakukhetha | |
| Ubulula bokusebenza | elula futhi elula | |
| Ukutholwa nokuhlaziywa kwedatha ye-SPC | I-SPC ejwayelekile | |
| Izidingo zobuchwepheshe zenethiwekhi | Izidingo ezijwayelekile | |
| Uhlelo lwemishini | Isakhiwo esikhulu semishini | i-monoblock cast |
| Imodi ye-Orbital | I-Monorail / ithrekhi emibili | |
| Indlela ye-XY | I-integral casting, intambo yocingo, isitimela somhlahlandlela | |
| Umhlahlandlela wemodi yokulungisa ububanzi besitimela | Ukunwetshwa okwenziwa ngesandla / okuzenzakalelayo | |
| Ukuma kwe-PCB kanye nemodi yokubopha | Isikhundla esiphezulu, i-cylinder clamping | |
| Ubude besitimela somhlahlandlela | 880-920mm | |
| PCB yokudlulisela isiqondiso | Okujwayelekile: kwesobunxele kuya kwesokudla | |
| Ikhompyutha | Umsingathi | Umsingathi onguchwepheshe i7 CPU |
| Amandla enkumbulo | 16G noma ngaphezulu | |
| Umthamo we-hard disk | 1TB | |
| Isistimu yokusebenza (OS) | Windows7 X64 NOMA Windows10 X64 | |
| Inkomba | 22' LCD (1920X1080) | |
| Ukuskena kwekhodi yebha / inethiwekhi yesizindalwazi | Ongakukhetha | |
| Izidingo zezisetshenziswa | Usayizi wesisetshenziswa (W*D*H) | 630*1620*1470 |
| Amandla | I-AC220V/1000VA | |
| Umfutho womoya osebenzayo | 0.5mpa | |
| Ukuma kwe-PCB | Ukuma kusilinda | |
| Isisindo sesisetshenziswa (Kg) | 1100kg | |
| Isevisi | Isevisi yokuthuthukisa isofthiwe | Inguqulo yamahhala yokuphila konke kwamahhala |
| Isevisi yangokwezifiso | Ukwenza ngokwezifiso okusebenzayo | |
| Izinto ezifanayo | Idivayisi noma isofthiwe yokuskena ikhodi yebha, imojuli yedatha ye-BAD MARK, ukuxhumana kwephrinta, ukuhlela ungaxhunyiwe ku-inthanethi noma indawo yokusebenza yokulungisa, ukwenza ngokwezifiso isofthiwe ye-SPC, ukuhlolwa kokuqagela kwe-3D, insizakalo yewaranti yomshini enwetshiwe, ukwenza ngokwezifiso umsebenzi wesofthiwe, ukuhlola ngokunemba / ithuluzi lokulungisa, umsebenzi we-NG / OK BUFFER , isibonisi sokuqapha esikabili; |
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