Isici
Uchungechunge lwe-MS-11 luwumshini we-3D SPI oxhumene nomugqa ohlola isimo senani le-solder ngemuva kokusabalala kwe-solder ukuze kubambe kahle inqubo.Ngekhamera engu-25 Megapixel enegalelo ekuthuthukisweni kokukhiqiza, ukuhlolwa kokunamathisela kwe-solder okungu-0201(mm) kungenzeka.
I-Dual Projection Probe
Ukuze unciphise iphutha elibangelwa izithunzi bese uthwebula izingxenye eziphezulu ngokuqagela okukodwa, kusetshenziswa i-dual probe probe.Ngesilinganiso esinembile nesinembile se-3D lapho uthwebula izilinganiso eziphakeme ezihlanekezelwe izilinganiso ngenxa yemiphumela yesithunzi ziyaqedwa ngokuphelele.
- Ukuqagela okukabili ukuxazulula ngokuphelele inkinga ye-deffused refelection shadowing
- Inhlanganisela yezithombe ezisuka kolunye uhlangothi ukuze uthole isilinganiso esiphelele sevolumu
- Ikhono lokulinganisa le-3D eliphelele nelinembile
Ikhamera Yokuqala Yokulungiswa Okuphezulu Yomhlaba engu-25 Megapixel
Siyaziqhenya ngokuthi sisebenzise isistimu yombono yesizukulwane esilandelayo enekhamera enokucaca okuphezulu engu-25 Megapixel ukuze sihlolwe okunembe kakhudlwana futhi okuzinzile kanye nendlela yokudlulisa isivinini esikhulu emhlabeni wonke ye-CoaXPress ukuvumela ukudluliswa kwedethi okuphindwe izikhathi ezingu-4 kanye no-40% okhuphule isivinini senqubo.
- Ikhamera yomhlaba engu-25 Megapixel kuphela elayishiwe
- Kusetshenziswe uhlelo lokubona kokusebenza okuphezulu kwe-CoaXPress
- I-FOV enkulu yokwandisa isivinini sokuhlola
- Isivinini sokucubungula sikhuphuke ngo-40% uma siqhathaniswa ne-Camera Link
Uhlelo Lokuhlola olunganamakhasi e-warpage
Umshini we-SPI uthola i-warpage ye-PCB ngaphakathi kwe-FOV ngenkathi uthwebula isithombe sebhodi, futhi usinxephezele ngokuzenzakalelayo, ukuze ama-PCB agobile akwazi ukuhlolwa ngaphandle kwanoma iyiphi inkinga.
- Ukuhlolwa kwe-Bent PCB ngaphandle kokunyakaza kwe-Z-Axis
- Amandla okuhlola asuka ku-±2mm ukuya ku-±5mm (kuye ngeLensi)
- Imiphumela enembe kakhudlwana ye-3D iqinisekisiwe.
Imininingwane yesithombe
Imininingwane
