Feature
MS-11 yakatevedzana inline 3D SPI muchina uyo unoongorora huwandu hwemutengesi mushure mekunge solder yapararira kuti inyatsonzwisisa maitiro.Iine 25 Megapixel kamera inobatsira mukuvandudza chibereko, 0201(mm) saizi solder paste yekuongorora inogoneka.
Dual Projection Probe
Kuti uderedze chikanganiso chinokonzerwa nemumvuri wobva wafungidzira zvinhu zvakakwirira zvine fungidziro imwechete, iyo mbiri yekufungidzira probe inoshandiswa.Nekuyera uye kwakaringana 3D kuyerwa kana kufungidzira yakakwirira zvikamu zvakamonyaniswa kuyerwa zvinokwanisika nekuda kwemumvuri mhedzisiro zvinobviswa zvachose.
- Dual fungidziro kugadzirisa zvachose deffused refelection shadowing dambudziko
- Musanganiswa wemifananidzo kubva kune yakatarisana yekuyera yakazara vhoriyamu
- Yakakwana uye chaiyo 3D kuyerwa kugona
Iyo Yekutanga Yekutanga Yepamusoro Resolution 25 Megapixel Kamera
Isu tinodada kuti takaisa chizvarwa chinotevera chechiratidzo chine 25 Megapixel high resolution kamera kuti inyatso ongorora uye yakagadzikana uye yepasi rose inomhanya yeCoaXPress nzira yekutumira inobvumidza kakapetwa ka4 kutapurirana kwemazuva uye 40% yakawedzera kukurumidza kukurumidza.
- Iyo chete 25 Megapixel kamera yepasi yakazara
- CoaXPress yakakwira performance vision system yakaiswa
- Hombe FOV yekuwedzera kukurumidza kwekuongorora
- Kumhanyisa kumhanya kwakawedzera ne40% zvichienzaniswa neCamera Link
Warpage-isina Inspection System
SPI muchina unoona iyo warpage yePCB mukati meFOV ichiri kutora bhodhi mufananidzo, uye woidzorera otomatiki, kuitira kuti maPCB akabhenda anogona kuongororwa pasina dambudziko.
- Bent PCB yekuongorora pasina Z-Axis kufamba
- Kuongorora kugona kubva ± 2mm kusvika ± 5mm (zvinoenderana neLens)
- Zvakawanda zvakarurama zve 3D zvinovimbiswa.
Detail Image
Zvinotsanangurwa
