Uphawu
Uluhlu lwe-MS-11 ngumatshini we-3D we-SPI ongaphakathi ohlola isimo semali ye-solder emva kokuba i-solder isasazeke ukuze ibambe ngokucacileyo inkqubo.Ngekhamera ye-25 ye-Megapixel enegalelo ekuphuculeni imveliso, ukuhlolwa kwe-solder ye-0201 (mm) ubukhulu be-solder kunokwenzeka.
Iprobe yoqikelelo oluphindwe kabini
Ukunciphisa impazamo ebangelwa yimithunzi emva koko ucinge amacandelo aphezulu kunye nentelekelelo enye, iprobe yeprojekthi ephindwe kabini iyasetyenziswa.Ngomlinganiselo ochanekileyo kunye nochanekileyo we-3D xa usenza umfanekiso wamacandelo aphezulu agqwethekileyo imilinganiselo enokwenzeka ngenxa yemiphumo yomthunzi iyapheliswa ngokupheleleyo.
- Uqikelelo oluphindwe kabini ukusombulula ngokupheleleyo ingxaki yomfanekiso wesithunzi ecinyiweyo
- Inhlanganisela yemifanekiso evela kwicala elichaseneyo kumlinganiselo opheleleyo wevolumu
- Ukukwazi ukulinganisa okugqibeleleyo kunye nokuchanekileyo kwe-3D
IKhamera yokuQala ePhakamileyo yokuQala yeHlabathi yeeMegapixel ezingama-25
Siyazingca ukuba sisebenzise inkqubo yombono wesizukulwana esilandelayo kunye nekhamera ye-25 ye-Megapixel ephezulu yokuhlolwa okuchanekileyo kunye nokuzinzileyo kunye neyona ndlela yehlabathi kuphela yesantya esiphezulu se-CoaXPress yokuhambisa indlela yokuhambisa i-4 amaxesha amaninzi ngakumbi ukuhanjiswa komhla kunye ne-40% yokwanda kwesantya senkqubo.
- Ikhamera ye-25 yemegapixel kuphela elayishiweyo
- Inkqubo yombono weCoaXPress ephezulu isetyenzisiwe
- I-FOV enkulu yokunyusa isantya sokuhlola
- Isantya sokucubungula sinyuke nge-40% xa kuthelekiswa neCamera Link
I-Warpage-free Inspection System
Umatshini we-SPI ubhaqa i-warpage ye-PCB ngaphakathi kwe-FOV ngelixa ibamba umfanekiso webhodi, kwaye uyibuyekeze ngokuzenzekelayo, ukuze ii-PCB ezigobileyo zihlolwe ngaphandle kwengxaki.
- Ukuhlolwa kwe-PCB egobileyo ngaphandle kwentshukumo ye-Z-Axis
- Ukwazi ukuhlola ukusuka ±2mm ukuya ±5mm (kuxhomekeke kwiLens)
- Iziphumo ezichaneke ngakumbi ze-3D ziqinisekisiwe.
Umfanekiso weenkcukacha
Iinkcukacha
