Hot Selling Heller 1826 MK7 PCB Reflow Soldering Oven

HELLER 1826MK7 10 temperature zone reflow oven technical parameters:

Model: 1826MK7
Type: Air or Nitrogen

1. The full hot air backflow heat transfer is fast, the thermal compensation efficiency is high, and the △t is less than ±2℃ for uniform welding.

2. HELLER has a history of more than 40 years, and its technology is mature.

3. The maintenance cost is low. When the furnace is in normal use, the power consumption is 12kw, and it is kept warm, and the heat emitted is less. The surface temperature of the furnace body is less than 40°C. The heat emitted has little radiation to the air conditioner, saving electricity and low cost. The furnace is stable and the welding quality is good.

4. The material of the equipment is good, the furnace hall is not deformed, the sealing ring of the furnace is not cracked, the overall service life of the equipment is long, and the function is reliable.

5. Built-in UPS power supply, with power-off protection function, no need to configure UPS

6. Using special materials with high temperature resistance, no corrosion, high-strength guide rails, high parallelism, no deformation. The PCB board will not fall off during the transfer process.

7. The temperature can reach 235℃-245℃, and can withstand the temperature of 350℃.

8. The error of the use window is small, and the smaller the error, the higher the qualified rate of the product.

9. One zone uses ir heating system to prevent the flow of nitrogen or oxygen.

10. The surface temperature of the furnace is not higher than 40°C, and the heat insulation performance is good.

11. Lubricant is automatically added without manual addition.

12. Fast cooling, only 3-4 seconds from solid state to liquid state, improving efficiency and making the circuit board more beautiful.