Umboneleli weSicombululo soBuchule be-SMT

Sombulula nayiphi na imibuzo onayo malunga ne-SMT
intloko_ibhena

Umgaqo osebenzayo wendawo yokufudumeza kwakhona.

Ireflow ovenUkufudumeza kuqala sisenzo sokufudumeza esenziwe ukuze kusebenze intlama yesolder kwaye kuthintelwe ukusilela kwamalungu okubangelwa kukufudumeza okukhawulezileyo kobushushu obuphezulu ngexesha lokuntywiliselwa kwetoti.Injongo yale ndawo kukutshisa i-PCB kwiqondo lokushisa ngokukhawuleza, kodwa izinga lokushisa kufuneka lilawulwe ngaphakathi koluhlu olufanelekileyo.Ukuba ikhawuleza kakhulu, ukutshitshiswa kwe-thermal kuya kwenzeka, kwaye ibhodi yesekethe kunye namacandelo anokonakala.Ukuba icotha kakhulu, i-solvent ayiyi kunyuka ngokwaneleyo, eya kuchaphazela umgangatho we-Welding.Ngenxa yesantya sokufudumeza ngokukhawuleza, ukuhluka kweqondo lokushisa kwigumbi lokutshisa i-reflow kwindawo yokugqibela yendawo yokushisa inkulu.Ukuze kuthintelwe umonakalo wamacandelo ngenxa yokutshatyalaliswa kwe-thermal, izinga eliphezulu lokufudumala lichazwe ngokubanzi njenge-4 ° C / S, kwaye izinga eliqhelekileyo lokunyuka libekwe kwi-1 ~ 3 ° C / S.


Ixesha lokuposa: Aug-24-2022