Intshayelelo yoShishino
I-LED flip chip ibhekisa kwitshiphu enokuthi idityaniswe ngokuthe ngqo kunye ne-ceramic substrate ngaphandle kocingo lwe-welding.Siyibiza ngokuba yi-DA chip.Yahlukile kwi-flip chip esafuna i-welding wire xa i-flip chip ikhutshelwa kwi-silicon okanye ezinye izinto ezincinci kwibakala lokuqala.Xa kuthelekiswa netshiphu yangaphambili yemveli, i-chip yemveli edityaniswe ngocingo lwentsimbi ijonge phezulu ngelixa i-flip crystal idityaniswe ne-substrate.Icala lombane letshiphu liphantsi, elilingana nokuguqula itshiphu yemveli
Iimpawu zeNkqubo
Izinto ezilungileyo zeFlip Chip
1. Akukho ukutshatyalaliswa kobushushu ngesafire, ukusebenza kakuhle kokutshatyalaliswa kobushushu.I-Flip-chip inokumelana ne-thermal ephantsi ngenxa yokuba umaleko osebenzayo usondele kwi-substrate, enciphisa indlela yokushisa ukusuka kumthombo wokushisa ukuya kwi-substrate.Olu phawu lwenza ukuba ukusebenza kwe-flip-chip kunciphe kancinci ukusuka ekukhanyeni ukuya kuzinzo lwe-thermal.
I-2.Okwesibini, ngokubhekiselele ekusebenzeni kwe-luminescence, i-drive ephezulu yangoku yenza ukukhanya okukhanyayo kuphezulu.I-Flip-chip ine-scalability yangoku ephezulu kunye nokusebenza koqhagamshelwano lwe-ohmic.Ukuhla kwamandla ombane e-Flip-chip kusezantsi kunesiqhelo kunye neetshiphu zesakhiwo esithe nkqo, nto leyo eyenza i-flip-chip ibe luncedo kakhulu phantsi kwe-drive yangoku ephezulu, ebonisa ukukhanya okuphezulu kokukhanya.
I-3.Ngaphantsi kwemeko yamandla aphezulu, i-flip chip ikhuselekile kwaye inokwethenjelwa kune-chip yangaphambili.Kwizixhobo ze-LED, ngokukodwa kwi-high-power, ukupakishwa kwe-Lens (ngaphandle kwesakhiwo se-lumen ye-shielded shielded), ngaphezu kwesiqingatha sesiganeko sesibane esifile sinxulumene nomonakalo wentambo yegolide.I-Flip chip inokupakishwa njengocingo olungenaGolide, olunciphisa ukuba nokwenzeka kwesibane esifileyo sesixhobo esivela kumthombo.
Okwesine, ubungakanani bunokuba buncinci, iindleko zokugcinwa kwemveliso zinokuncitshiswa, kwaye i-optics inokuhambelana ngokulula.Kwangaxeshanye, ikwabeka isiseko sophuhliso lwenkqubo yokupakisha elandelayo.
I-Advantage yeMveliso
Itekhnoloji enelungelo elilodwa lomenzi we-TYtech: Inkqubo yokujikeleza ngenkani yomoya oshushu, enobushushu obukumgangatho wehlabathi kunye nokusebenza kakuhle kokufudumeza.
Zonke iindawo zokushisa zifudumala phezulu nangaphantsi, zijikelezwe ngokuzimeleyo kwaye zilawulwa ngokuzimeleyo.Ukuchaneka kolawulo lobushushu kwindawo nganye yobushushu ngu (+ C).
Ubushushu obugqwesileyo obufanayo.Ukutenxa kobushushu obunqamlezileyo kumphezulu wepleyiti engenanto ngu (+) C.
I-front and back circulation return air design inokuthintela ngokufanelekileyo impembelelo yokuhamba komoya kwindawo yokushisa kunye nommandla wokushisa, ukuqinisa ulawulo lobushushu kunye nokuqinisekisa ukufudumeza okufanayo kwamacandelo.
I-furnace yenziwe ngensimbi engenasici, ubushushu kunye ne-corrosion resistant, kulula ukuyicoca.
Isisombululo
I-TYtech Inverted Reflow Welding Furnace
Umenzi wewelding reflow inverted
Ukuthengiswa kwakhona kwe-LED flip chip
I-welding ye-reflow eguqulweyo
CSP flip reflow welding