Isingeniso Semboni
I-LED flip chip isho i-chip engaboshwa ngokuqondile nge-ceramic substrate ngaphandle kwentambo yokushisela.Siyibiza nge-DA chip.Ihlukile ku-flip chip esadinga intambo yokushisela lapho i-flip chip idluliselwa ku-silicon noma ezinye izinto ezincane ezingaphansi ekuqaleni.Uma kuqhathaniswa ne-chip yendabuko eya phambili, i-flip chip yendabuko eboshwe ngentambo yensimbi ibheke phezulu kuyilapho i-flip crystal ixhunywe ne-substrate.Uhlangothi lukagesi lwe-chip luphansi, okulingana nokuphendula chip yomdabu
Izici Zenqubo
Izinzuzo ze-Flip Chip
1. Akukho ukukhishwa kokushisa ngesafire, ukusebenza kahle kokukhipha ukushisa.I-Flip-chip inokumelana nokushisa okuphansi ngoba isendlalelo esisebenzayo siseduze ne-substrate, efinyeza indlela yokushisa ukusuka emthonjeni wokushisa kuya ku-substrate.Lesi sici senza ukusebenza kwe-flip-chip kwehle kancane ukusuka ekukhanyeni kuya ekuzinzeni kokushisa.
2.Okwesibili, mayelana nokusebenza kwe-luminescence, idrayivu yamanje ephezulu yenza ukukhanya kuphakeme.I-Flip-chip inokukala okuphezulu kwamanje nokusebenza kokuxhumana kwe-ohmic.Ukwehla kwamandla kagesi e-Flip-chip ngokuvamile kuphansi kunama-chips esakhiwo avamile naqondile, okwenza i-flip-chip ibe nenzuzo kakhulu ngaphansi kokushayela kwamanje okuphezulu, okubonisa ukusebenza kahle kokukhanya okuphezulu.
I-3.Ngaphansi kwesimo samandla aphezulu, i-flip chip ivikeleke kakhulu futhi inokwethenjelwa kune-chip yangaphambili.Kumadivayisi e-LED, ikakhulukazi emaphaketheni anamandla aphezulu, i-Lens (ngaphandle kwesakhiwo se-lumen yesihlangu esivikelwe), ngaphezu kwesigamu sesenzakalo sesibani esifile sihlobene nokulimala kocingo lwegolide.I-Flip chip ingapakishwa njengocingo olungenagolide, okunciphisa amathuba esibani esifile esivela emthonjeni.
Okwesine, ubukhulu bungaba buncane, izindleko zokugcinwa komkhiqizo zingancishiswa, futhi ama-optics angafaniswa kalula.Ngesikhathi esifanayo, iphinde ibeke isisekelo sokuthuthukiswa kwenqubo yokupakisha elandelayo.
Inzuzo Yomkhiqizo
Ubuchwepheshe obunelungelo lobunikazi be-TYtech: Uhlelo lokujikeleza komoya oshisayo oluphoqelelayo oluphoqelelayo, olunezinga lokushisa elilinganayo lezinga lomhlaba kanye nokusebenza kahle kokushisisa.
Zonke izindawo zokushisa zishiselwa phezulu naphansi, zisakazwa ngokuzimela futhi zilawulwa ngokuzimela.Ukunemba kokulawula izinga lokushisa endaweni ngayinye yokushisa ngu-(+ C).
Ukufana kwezinga lokushisa okuhle kakhulu.Ukuchezuka kwezinga lokushisa eliphambene lepuleti elingenalutho ngu-(+) C.
I-front and back circulation return air design ingavimbela ngokuphumelelayo ithonya lokugeleza komoya endaweni yokushisa nendawo yokushisa, iqinise ukulawula izinga lokushisa futhi iqinisekise ukushisa okufanayo kwezingxenye.
Isithando somlilo senziwe ngensimbi engagqwali, ukumelana nokushisa nokugqwala, kulula ukusihlanza.
Isixazululo
I-TYtech Inverted Reflow Welding Furnace
Umkhiqizi we-welding we-reflow ohlanekezelwe
Geza kabusha i-solder ye-LED flip chip
I-reflow welding eguquliwe
I-CSP flip reflow welding