Inkqubo ye-soldering ye-hot reflow soldering yinkqubo yokudlulisa ubushushu.Ngaphambi kokuba uqale "ukupheka" ibhodi ekujoliswe kuyo, ubushushu bendawo ye-oven yokubuyisela kufuneka bumiselwe.
Ubushushu bommandla we-oveni yokuqukumbela yindawo ebekiweyo apho into yobushushu iya kufudunyezwa ukufikelela kule ndawo ibekiweyo yobushushu.Le yinkqubo yokulawula iluphu evaliweyo usebenzisa ingcamango yolawulo ye-PID yanamhlanje.Idatha yobushushu bomoya oshushu malunga nale nto yobushushu iya kubuyiselwa kwisilawuli, esithatha isigqibo sokuvula okanye ukucima amandla obushushu.
Kukho izinto ezininzi ezichaphazela amandla ebhodi ukufudumala ngokuchanekileyo.Izinto eziphambili zezi:
- Ubushushu bokuqala bePCB
Kwiimeko ezininzi, ubushushu bokuqala bePCB buyafana nobushushu begumbi.Okukhona umahluko omkhulu phakathi kobushushu bePCB kunye nobushushu begumbi le-oveni, kokukhona ibhodi yePCB iya kufumana ubushushu ngokukhawuleza.
- Hlaziya ubushushu begumbi le-oveni
Reflow ubushushu begumbi le-oveni bubushushu bomoya oshushu.Inokuthi inxulumene neqondo lokushisa lokumisa i-oven ngokuthe ngqo;nangona kunjalo, ayifani nexabiso lokumisela indawo.
- Ukumelana nobushushu bokudluliselwa kobushushu
Yonke into inokumelana ne-thermal.Iintsimbi zinokumelana okuncinci kwe-thermal kunezixhobo ezingezizo ezentsimbi, ngoko ke inani le-PCB kunye nobukhulu be-cooper liya kuchaphazela ukuhanjiswa kobushushu.
- PCB amandla thermal
I-PCB ye-thermal capacitance ichaphazela uzinzo lwe-thermal yebhodi ekujoliswe kuyo.Kwakhona iparameter ephambili ekufumaneni umgangatho we-soldering.Ubukhulu bePCB kunye nezixhobo ze-thermal capacitance ziyakuchaphazela ukuhanjiswa kobushushu.
Isiphelo sithi:
Ubushushu bokusetha i-oveni alufani ncam nobushushu bePCB.Xa ufuna ukwandisa iprofayile yokuphinda uqukunjelwe, kufuneka uhlalutye iiparamitha zebhodi ezinje ngobunzima bebhodi, ubukhulu bobhedu, kunye nezixhobo kunye nokuqhelana nesakhono sakho se-oveni yokuqukuqela.
Ixesha lokuposa: Jul-07-2022