I-SMT Reflow Oven Manufacture PCB Reflow Soldering machine TYtech 6010

1. Ikhompyutha ye-Brand LCD + isistimu yokulawula ehlakaniphile ye-PLC yamukelwe, ngokunemba okuphezulu kokulawula izinga lokushisa okungu-±1°C (uma ikhompuyutha iphahlazeka kungalindelekile, umsebenzi ongaxhunyiwe ku-inthanethi ungenziwa ngaphandle kokuthikame ukukhiqiza), ukuqinisekisa ukuzinza nokuthembeka kwesistimu yokulawula. ;

2. I-interface yokusebenza ye-Windows7, inamandla futhi kulula ukuyisebenzisa;

3. Ukuvulwa komzimba wesithando somlilo ongaphezulu kusebenzisa imishini ephindwe kabili kagesi ye-jacking ukuqinisekisa ukuphepha nokuthembeka;

4. Ifakwe idivayisi yokuqinisa ibhande le-mesh, izinto zokuhamba zizinzile, azinyakazi, azikho ukuguquguquka, ziqinisekisa ukuthuthwa okubushelelezi kwe-PCB;

5. I-synchronous guide transmission mechanism (ingaxhunywa ku-inthanethi ngomshini wokubeka ozishintshayo) ukuze kuqinisekiswe ukulungiswa okunembile kobubanzi besitimela esiwumhlahlandlela nokuphila kwesevisi ephezulu;(uma uthanda umzila wesitimela)

6. Lawula ngokuzenzakalelayo uhlelo lokuthambisa, olungagcoba ngokuzenzakalelayo uchungechunge lokudlulisela ngokusetha isikhathi sokugcwalisa kanye nenani lokugcwalisa;

7. Zonke izindawo zokushisisa ziyi-PID elawulwa yikhompyutha (izindawo zokushisa zingavulwa ngokuhlukana. Ukushisa kungahlukaniswa ngamazoni ukuze kuncishiswe amandla okuqala);

8. Ukudluliswa kwenethiwekhi/amaketango kuvalwe ngokuphelele iluphu elawulwa yikhompuyutha, engahlangabezana nokukhiqizwa ngesikhathi esisodwa kwezinhlobo ezahlukene zama-PCB;

9. Ngomsindo wephutha kanye nomsebenzi we-alamu wokukhanya;

10. Ifakwe isivikelo sokuvuza ukuze kuqinisekiswe ukuphepha kwabaqhubi nohlelo lokulawula;

11. I-UPS eyakhelwe ngaphakathi kanye nohlelo lokulibaziseka oluzenzakalelayo ukuze kuqinisekiswe ukuthi i-PCB kanye nomshini wokugcwalisa i-solder ngeke wonakaliswe lapho ugesi unqanyulwa noma ushiswa ngokweqile;

12. Yamukela indlela yokushisa ye-HELLER yokushisa komoya oshisayo, umgudu womoya osebenza kahle kakhulu ocindezelwe, ukwandise kakhulu ukugeleza komoya oshisayo ojikelezayo, ukukhuphuka kwezinga lokushisa ngokushesha (cishe imizuzu eyi-10), ukusebenza kahle kwesinxephezelo sokushisa okuphezulu, kanye ne-welding ephezulu yokushisa nokuphulukisa;

13. Indawo yokushisa ifakwe inzwa ezimele ezwa izinga lokushisa ukuze igade futhi inxephezele ibhalansi yezinga lokushisa yendawo ngayinye yokushisa ngesikhathi sangempela;

14. Uhlelo lokusebenza olunokuphathwa kwephasiwedi luvimbela abasebenzi abangahlobene ekuguquleni imingcele yenqubo, futhi ukuphathwa kwerekhodi lokusebenza kungakwazi ukulandelela inqubo yokushintsha imingcele yenqubo, ekulungele ukuthuthukisa ukuphathwa.Ingagcina izilungiselelo zejubane lokushisa elikhona lomsebenzisi kanye nejika lezinga lokushisa ngaphansi kwesilungiselelo, futhi ingashintsha yonke idatha yokuphrinta namajika;

15. Iwindi lokulawula elididiyelwe, ukushintshwa kwekhompyutha, ijika lokuhlola, ijika lokuphrinta kanye nokudluliswa kwedatha konke kulula ukusebenza, futhi umklamo wenziwa umuntu.Ifakwe uhlelo lwe-inthanethi lokuhlola ijika lokushisa kwejika lokushisa elineziteshi ezintathu, elikwazi ukubona ijika langempela lokushisa lento yokushisela noma kunini (asikho isidingo sokumisa isihloli sejika lokushisa);

16. Uhlelo lokupholisa olusheshayo oluvela kubuchwepheshe bamazwe ngamazwe lisebenzisa ukupholisa ingilazi ekhulisayo endaweni eyodwa futhi ephumelelayo esheshayo, isivinini sokupholisa singafinyelela ku-3.5~6°C/sec, futhi ukuphatha kulula kakhulu;idivayisi yokupholisa ephoqelekile yangaphandle iqinisekisa umphumela we-crystallization wamalunga e-solder (Inketho yokuzikhethela, ukucushwa okujwayelekile kuphoqeleka ukupholisa umoya wemvelo);

17. Uhlelo lokubuyisela i-rosin: I-rosin igeleza ngendlela eqondile, elula kakhulu ukushintshwa nokuhlanza.Amapayipi akhethekile asetshenziselwa ukuhambisa igesi ephumayo, engakhathalelwa impilo yonke;

18. Isakhiwo esikhethekile sezokuthutha komoya esicindezelwe kanye nomklamo wezintambo zokufudumeza ezimise okukhethekile, akukho msindo, akukho ukudlidliza, izinga lokushisa eliphezulu lokushintshaniswa kokushisa, umehluko wokushisa △t phakathi kokuphansi kwe-BGA nebhodi le-PCB lincane kakhulu, elihlangabezana kahle kakhulu nemithetho eqinile. izimfuneko zenqubo yokungenamthofu , ikakhulukazi emikhiqizweni engenamthofu enezidingo zokusoda ezinobunzima obukhulu.