E like me ka Sn mea i loaʻa ma mua o 95% i loko o ka SnAgCu alakai-noa solder , pela i ka hoohalike ana me ka kuʻuna solder , ka mahuahua ana o na mea o Sn a me ka mahana o Lead-free soldering kaʻina e alakai i ka oxidation o ka solder mahuahua. e ho'ēmi i ka oxidation o solder slag, dross, pono mākou e hoʻomaopopo mua i nā ʻano a me nā kaʻina hana.
E noonooia keia mau mea ekolu.
(1) ʻO ka ʻili paʻa o ke kiʻi oxide, he ʻano kūlohelohe kēia o Sn oxide, ʻoiai ʻaʻole i haki ke kiʻi oxide, no ka mea e pale aku i ka hana hou ʻana o ka nui o ka oxidation.E like me ka mea i hōʻike ʻia ma lalo nei:
(2) ʻO ka pauka ʻeleʻele, ma muli o ka friction o ke kiʻi kiʻekiʻe rotating impeller shaft a me Sn oxide film, ʻo ia ka hana spheroidizing huahana, a ʻoi aku ka nui o nā ʻāpana.E like me ka mea i hōʻike ʻia ma ke kiʻi ma lalo nei:
（3）Bean curd koena, aia i loko o ka nozzle periphery o turbulent nalu a me ka maluhia nalu, helu no ka nui loa o ka holoʻokoʻa o ka oxide slag.
ʻO ke koena bean curd i hoʻokumu ʻia e ka oxygen kaomi maikaʻi ʻole i ka shear slag, a me ka hopena o ka wailele i ka hopena hui o nā kumu like ʻole, ʻo ke kaʻina hana kūikawā penei:
ʻO ka ʻāpana ʻeleʻele ka mea ea, ʻo ka mahana wai e hāʻule keʻokeʻo Sn.t = t3 kiʻi hiki iā mākou ke ʻike i kahi ʻāpana liʻiliʻi o ka ea i ale ʻia i ka solution solder, ʻo kahi hapa liʻiliʻi o ka ea ma muli o ka wikiwiki o ka oxygen i loko o ka pahu e puka mai i luna akā ʻaʻole hiki ke hoʻopau i ke kinoea N2, a no laila e hana i nā pōpō puhaka. , No ka mea, ua oi aku ka li'ili'i o ka poepoe puha ma mua o ko ke tini, e puka mai ana ka ili o ke kini i ka wa i hoahuia ai keia poepoe puha e lana ana ma ka ili kino koena Bean curd.
I ka ʻike ʻana i nā kumu a me nā ʻano mea hana tin, ke manaʻoʻiʻo nei mākou ʻo ka hoʻohaʻahaʻa ʻana i ke koena o ka Bean curd e hōʻemi i nā hana ʻoi loa.Mai ka mea i luna aʻe hiki ke ʻike ʻia ke kaʻina hana ikaika: ʻelua mau kūlana kūpono ka hollow o nā pōpō solder:
ʻO ka mea e koi mua ai ka hopena palena, ka ʻili o ka tin me kahi roll dramatic, e hana ana i ka phagocytosis.
ʻO ka lua o ke koi ʻana he pōpō puʻu i loko e hana i kahi kiʻiʻoniʻoni oxide nui, ua hoʻokumu ʻia ke kinoea nitrogen i loko o ka pā.A i ʻole, lana ʻo ia ma ka ʻili o ka solder i ka wā e haki ʻia ai ka pōleʻa hollow, ʻaʻole hiki ke hana i kahi "koena bean curd."
ʻO kēia mau kūlana kūponoʻelua he mea nui.
ʻO nā ana o ka hōʻemi ʻana i ka lepo i ka nalu ʻana e hōʻike ana penei:
1. E ho'ēmi i ke āpau i hanaʻia i ka wā e hoʻololi ai i ka nalu, e ho'ēmiʻia ka reflow solder bump ho'āʻo e ho'ēmi i ka'ōwili, a laila e ho'ēmi i ka hanauna o ka phagocytosis.
No laila ua hoʻololi mākou i ka ʻāpana keʻa o ka ipu hao i loko o kahi trapezoid, a hana i ka nalu mua i kahi kokoke loa i ka lihi o ka ipu hao.
2. Ma ka nalu mua a me ka nalu ʻelua, hoʻohui mākou i ka mea pale i kānana ʻole ʻia i ka solder tumbling-flow.
3. E lawe i ka pale N2 e pale aku i ka hana ʻana o nā membrane oxide nui i ka pōlele solder.
Ka manawa hoʻouna: Mar-22-2022