Raws li cov khoom xyaw Sn muaj ntau tshaj 95% nyob rau hauv SnAgCu lead-free solder, yog li nyob rau hauv kev sib piv nrog cov tsoos solder, qhov nce ntawm cov khoom xyaw ntawm Sn thiab kub ntawm cov hlau lead-free soldering txheej txheem yuav ua rau oxidation ntawm cov solder nce .Ua ntej txo cov oxidation ntawm solder slag, dross, peb yuav tsum xub nkag siab txog hom thiab molding txheej txheem.
Peb cov hauv qab no yuav tsum raug xam tias:
(1) Qhov chaw zoo li qub ntawm oxide zaj duab xis, qhov no yog qhov tshwm sim ntawm Sn oxide, tsuav yog cov oxide zaj duab xis tsis tawg, vim nws yuav tiv thaiv kev tsim cov oxidation ntxiv.Raws li qhia hauv qab no:
(2) Cov hmoov dub, vim yog kev sib txhuam ntawm kev kub ceev rotating impeller ncej thiab Sn oxide zaj duab xis, yog cov spheroidizing cov khoom tsim, thiab cov khoom loj dua.Raws li pom hauv daim duab hauv qab no:
(3) Taum curd residue, feem ntau yog nyob rau hauv lub nozzle periphery ntawm turbulent nthwv dej thiab kev thaj yeeb yoj, suav rau feem coob ntawm tag nrho cov luj ntawm oxide slag.
Taum curd residue yog tshwm sim los ntawm qhov tsis zoo siab oxygen rau shear slag, thiab cov nyhuv dej tsaws tsag hauv kev sib xyaw ua ke ntawm ntau yam, cov txheej txheem tshwj xeeb yog raws li hauv qab no:
Lub cheeb tsam dub yog huab cua interface, cov kua kub kub tumbling dawb Sn.t = t3 daim duab peb tuaj yeem pom ib feem me me ntawm huab cua yog nqos ntawm cov tshuaj tov, ib feem me me ntawm cov huab cua vim oxidation sai ntawm cov pa hauv cov tin yuav ntog tab sis tsis tuaj yeem tshem tawm N2 roj, thiab yog li tsim cov pob hollow. , Txij li qhov ntom ntawm lub pob hollow yog me dua li ntawm cov tin, tin nto yog khi kom tshwm sim thaum cov pob hollow ib zaug muab tso rau hauv cov pob zeb hauv av taum curd residue tin nto.
Paub txog qhov ua rau thiab tin tsim hom, peb ntseeg hais tias txo qhov tsim ntawm Bean curd residue yog txo yoj soldering tin slag zoo tshaj plaws ntsuas.Los ntawm cov saum toj no nws tuaj yeem pom cov txheej txheem dynamic: hollow ntawm cov pob solder yog ob yam tsim nyog:
Thawj qhov yuav tsum tau ua ua ntej yog qhov cuam tshuam ntawm ciam teb, tin nto nrog ib qho kev ua yeeb yam yob, tsim phagocytosis.
Qhov thib ob yuav tsum muaj lub pob hauv sab hauv los ua cov yeeb yaj kiab tuab, cov pa nitrogen roj yog tsim nyob hauv pob.Txwv tsis pub nws ntab rau ntawm qhov chaw ntawm lub tshuab thaum lub pob hollow yuav tawg, tsis tuaj yeem tsim "Bean curd residue."
Ob yam uas tsim nyog no yog indispensable.
Cov kev ntsuas ntawm kev txo dross nyob rau hauv yoj soldering qhia raws li nram no:
1.Txo qhov sib txawv generated thaum switching nthwv dej, uas yuav txo tau reflow solder pob siv zog los txo cov yob, yog li txo cov tiam ntawm phagocytosis.
Yog li ntawd, peb hloov qhov hla ntawm lub lauj kaub rau hauv lub trapezoid, thiab ua rau thawj nthwv dej kom deb li deb tau ze rau ntawm ntug ntawm lub lauj kaub.
2. Nyob rau hauv ob qho tib si ntawm thawj nthwv dej thiab lub nthwv dej thib ob peb ntxiv cov khoom siv tsis muaj qhov cuam tshuam rau lub tshuab nqus dej.
3. Siv cov N2 tiv thaiv kom tsis txhob muaj ntau tiam neeg ntawm cov membranes ntom nti hauv pob.
Post lub sij hawm: Mar-22-2022