Njengoba izithako ze-Sn eziqukethe zingaphezu kuka-95% ku-solder engenawo umthofu we-SnAgCu, ngakho-ke uma kuqhathaniswa ne-solder yendabuko, ukwanda kwezithako ze-Sn kanye nokushisa kwenqubo ye-Lead-free soldering inqubo kuzoholela ekukhuleni kwe-oxidation ye-solder .Ngaphambi ukunciphisa i-oxidation ye-solder slag, i-dross, kufanele siqale siqonde izinhlobo nezinqubo zokubumba.
Okuthathu okulandelayo kuzocatshangelwa:
(1) Indawo emile yefilimu ye-oxide, lokhu kuyisenzakalo semvelo se-Sn oxide, inqobo nje uma ifilimu ye-oxide ingaphukile, ngoba izovimbela ukukhiqizwa okwengeziwe kwenani le-oxidation.Njengoba kuboniswe ngezansi:
(2) Impushana emnyama, ngenxa yokungqubuzana kwe-impeller shaft ejikelezayo enesivinini esikhulu kanye nefilimu ye-Sn oxide, kwaba ukukhiqizwa komkhiqizo we-spheroidizing, futhi izinhlayiya zikhudlwana.Njengoba kuboniswe emfanekisweni ongezansi:
(3) Izinsalela zecurd kabhontshisi, ikakhulukazi endaweni yomlomo womlomo wamagagasi aneziyaluyalu namagagasi okuthula, abangela ingxenye enkulu yaso sonke isisindo se-oxide slag.
Izinsalela zikabhontshisi we-curd zidalwe ukucindezela okungekuhle kwe-oxygen ku-shear slag, kanye nomthelela wempophoma kumphumela wenhlanganisela yezinto ezahlukahlukene, inqubo ethile eguquguqukayo imi kanje:
Indawo emnyama iyisixhumi esibonakalayo somoya, izinga lokushisa eliwuketshezi lehla elimhlophe Sn.t = t3 figure singabona ingxenye encane yomoya igwinywa kusisombululo se-solder, ingxenye encane yomoya ngenxa ye-oxidation esheshayo ye-oksijeni ngaphakathi kwe-tin izovela kodwa ayikwazi ukuqeda igesi ye-N2, ngakho-ke yenza amabhola angenalutho. , Njengoba ukuminyana kwebhola elingenalutho lincane kakhulu kunelikathini, indawo kathayela nakanjani izovela lapho la mabhola angenalutho enqwabelene ukuze akhe ukuntanta endaweni kathayela oyinsalela ye-curd.
Ukwazi izimbangela nezinhlobo ezakha ithini, sikholelwa ukuthi ukwehlisa ukwakheka kwezinsalela ze-Bean curd ukunciphisa i-wave soldering tin slag izinyathelo ezisebenza kakhulu.Kusukela ngenhla kungase kubonakale inqubo ashukumisayo: ongenalutho amabhola solder izimo ezimbili ezidingekayo:
Imfuneko yokuqala iwumphumela womngcele, indawo yethini enomqulu omangalisayo, okwenza i-phagocytosis.
Isidingo sesibili siyibhola elingenalutho ngaphakathi ukuze lenze ifilimu ye-oxide eminyene, igesi ye-nitrogen yakha ngaphakathi kwephakheji.Uma kungenjalo intanta ebusweni be-solder lapho ibhola elingenalutho lizophulwa, lingakwazi ukwakha "insalela ye-curd kabhontshisi."
Lezi zimo ezimbili ezidingekayo zibalulekile.
Izinyathelo zokunciphisa amanyela ekufakweni kwe-wave soldering zibonisa kanje:
1.Ukunciphisa igebe elikhiqizwe lapho kushintshwa igagasi, okuzoncishiswa imizamo yokugeleza kabusha kwe-solder yokunciphisa umqulu, ngaleyo ndlela kuncishiswe ukukhiqizwa kwe-phagocytosis.
Ngakho-ke sashintsha ingxenye yesiphambano sebhodwe le-solder yaba i-trapezoid, futhi senza igagasi lokuqala lisondele eduze konqenqema lwebhodwe le-solder.
2. Kokubili igagasi lokuqala nelesibili sengeza idivayisi yokuvimbela engahlungiwe ku-solder-flow flow.
3. Thatha isivikelo se-N2 ukuze ugweme ukukhiqizwa kolwelwesi oluminyene lwe-oxide ebholeni le-solder.
Isikhathi sokuthumela: Mar-22-2022