Profaịlụ mweghachi na-enweghị ndu: Ụdị nfe vs. Ụdị Slumping

Nrụgharị reflow bụ usoro nke na-esi na tapawa solder kpụ ọkụ n'ọnụ wee gbanwee gaa n'ala gbazere ka ijikọ ihe ntụtụ na paịlị PCB ọnụ kpamkpam.

Enwere nzọụkwụ/mpaghara anọ na usoro a - preheating, teta, reflow na jụrụ oyi.

N'ihi na omenala trapezoidal ụdị profaịlụ ndabere na lead free solder mado nke Bittele na-eji maka SMT mgbakọ usoro:

1. Mpaghara ebe a na-ekpo ọkụ: Preheat na-ezokarị aka ịbawanye okpomọkụ site na okpomọkụ nkịtị ruo 150 ° C na site na 150 °C ruo 180 C. Okpomọkụ sitere na nkịtị ruo 150 ° C bụ ihe na-erughị 5 ° C / sec (na 1.5 ° C ~ 3). Celsius C / sk), na oge n'etiti 150 ° C na 180 Celsius C dị gburugburu 60 ~ 220 sec.Uru nke ikpo ọkụ na-adị nwayọọ bụ ikwe ka ihe mgbaze na mmiri dị na vapo paste pụta n'oge.Ọ na-emekwa ka nnukwu ihe mejupụtara ya na-ekpo ọkụ mgbe niile na obere ihe ndị ọzọ.
2. Mpaghara ime mmiri: A na-akpọkwa oge ikpo ọkụ site na 150 Celsius C ruo ebe a wụrụ awụ dị ka oge ịcha mmiri, nke pụtara na mmiri na-arụ ọrụ ma na-ewepụ ihe mgbakwunye oxidized na elu igwe ka ọ dị njikere ịme ezigbo nkwonkwo solder. n'etiti ntụtụ components na PCB pads.
3. Mpaghara ntughari: Mpaghara ntughari, nke a na-akpọkwa “oge n'elu liquidus” (TAL), bụ akụkụ nke usoro ebe a na-enweta okpomọkụ kachasị elu.Okpomọkụ kachasị elu bụ 20-40 Celsius C karịa mmiri mmiri.
4. Mpaghara jụrụ oyi: Na mpaghara jụrụ oyi, okpomọkụ na-eji nwayọọ nwayọọ na-ebelata ma na-eme nkwonkwo solder siri ike.Ọ dị mkpa ka echebara mkpọda mkpọda jụrụ oyi kacha mma iji zere ntụpọ ọ bụla ghara ime.A na-atụ aro ọnụego jụrụ oyi nke 4 Celsius C/s.

Enwere profaịlụ abụọ dị iche iche na-etinye aka na usoro nlọghachi azụ - ụdị ncha na ụdị slumping.

Ụdị Soaking yiri ọdịdị trapezoidal ebe ụdị slumping nwere ọdịdị delta.Ọ bụrụ na bọọdụ ahụ dị mfe ma ọ nweghị ihe mgbagwoju anya dị ka BGA ma ọ bụ nnukwu ihe dị na bọọdụ ahụ, profaịlụ ụdị slumping ga-akacha mma.