Ke hoʻolako nei ʻo SMT Assembly Company i ka hui BGA, me nā lawelawe BGA Rework a me BGA Reballing i loko o ka ʻoihana Paipai Kaapuni Board Assembly mai 2003. Me nā mea hoʻonoho BGA kūlana kiʻekiʻe, nā kaʻina hui BGA kiʻekiʻe, ka ʻoki ʻoki X- ʻO nā mea hana ʻo Ray Inspection, a me nā ʻōnaehana PCB Assembly kūpono loa, hiki iā ʻoe ke hilinaʻi iā mākou e kūkulu i nā papa BGA kiʻekiʻe a kiʻekiʻe.
Hiki i ka Hui BGA
Loa'a i ka Hui Hui Hui SMT kahi Hui Hui Hui SMT ka nui o ka ike e lawelawe ana i na ano BGA a pau, e like me DSBGA a me na Mea Pakiki e ae, mai na BGA micro (2mmX3mm) a i na BGA nui (45 mm);mai nā BGA seramika a i nā BGA plastik.hiki iā lākou ke kau i ka liʻiliʻi o 0.4 mm pitch BGA ma ySMT Assembly Company PCB.
BGA Hui Kaʻina Hana/Thermal profiles
He mea koʻikoʻi loa ka ʻaoʻao Thermal no BGA i ke kaʻina hana PCB Assembly.E alakaʻi ka hui hana ʻo SMT Assembly Company i kahi DFM Check no ka nānā ʻana i nā faila PCB ySMT Assembly Company a me ka ʻikepili BGA no ka hoʻomohala ʻana i kahi kiʻi wela kūpono no ke kaʻina hana hui BGA ySMT Assembly Company.E noʻonoʻo ʻo SMT Assembly Company i ka nui o ka BGA a me ka hoʻokumu ʻana i nā mea pōpō BGA (alakaʻi a i ʻole Lead-Free) no ka hana ʻana i nā kiʻi wela kūpono.
I ka nui o ka BGA kino nui, SMT Hui Hui e optimize i ka thermal profile e localize i ka wela ma ka BGA kūloko e pale aku i nā voids a me nā mea maʻamau PCB Assembly Faults.Hoʻopili ʻo SMT Assembly Company i nā alakaʻi alakaʻi IPC Class II a i ʻole Class III Quality Management e hōʻoia i nā hemahema ma lalo o 25% o ka nui o ke anawaena pōpō solder.E hele ana nā BGA me ke alakaʻi ʻole i kahi ʻaoʻao wela kūikawā alakaʻi ʻole e pale aku i nā pilikia pōpō hāmama e hiki mai ana mai ka loSMT Assembly Companyr wela;ma kekahi ʻaoʻao, e hele nā BGA alakaʻi i kahi kaʻina alakaʻi alakaʻi kūikawā e pale ai i nā wela kiʻekiʻe mai ka hana ʻana i nā pōkole pine.Ke loaʻa iā SMT Assembly Company ke kauoha ʻo ySMT Assembly Company Turn-Key PCB Assembly, e nānā ʻo SMT Assembly Company i ka hoʻolālā PCB ySMT Assembly Company e nānā i nā manaʻo kikoʻī i nā mea BGA i ka wā o ka SMT Assembly Company meticulous DFM (Design for Manufacturability).
Loaʻa ka hōʻoia piha ʻana i nā loiloi no ka PCB Laminate Material compatibility, Surface Finish effects, ka nui o ka warpage koi a me ka Solder Mask clearance.Hoʻopili kēia mau mea āpau i ka maikaʻi o ka hui BGA.
BGA kūʻai, BGA Rework & Reballing
Loaʻa paha iā ʻoe he mau BGA liʻiliʻi a i ʻole nā ʻāpana pitch maikaʻi ma nā papa PC Hui Hui Hui ySMT e koi ana i ka hui PCB no ka prototyping R&D.Hiki ke kōkua ʻo SMT Assembly Company - Hāʻawi ʻo SMT Assembly Company i kahi lawelawe kūʻai BGA kūikawā no ka hoʻāʻo ʻana a me ka loiloi ʻana ma ke ʻano he ʻāpana o ka SMT Assembly Company e kālele ana i ka Prototype PCB Assembly.
Eia hou, hiki i ka Hui Hui Hui SMT ke kōkua iā ʻoe me ka BGA rework a me BGA reballing ma ke kumu kūʻai kūpono!Hana ʻo SMT Assembly Company i ʻelima mau ʻanuʻu kumu no ka hana hou ʻana i ka BGA: ka wehe ʻana i nā mea, ka hoʻomākaukau ʻana i ka pūnaewele, ka palapala noi solder paste, ka pani BGA, a me ka Reflow Soldering.Hōʻoia ka SMT Assembly Company he 100% o nā papa Hui Hui Hui ySMT e holo pono ana ke hoʻihoʻi ʻia iā ʻoe.
Nānā X-Ray Hui BGA
Hoʻohana ʻo SMT Assembly Company i kahi mīkini X-Ray e ʻike i nā hemahema like ʻole e hiki mai ana i ka wā o ka hui BGA.
Ma o ka nānā ʻana i ka X-ray, hiki i ka SMT Assembly Company ke hoʻopau i nā pilikia kūʻai aku ma ka papa, e like me Solder Balls a Paste Bridging.Eia kekahi, hiki i ka polokalamu kākoʻo X-Ray SMT Assembly Company ke helu i ka nui o ka ʻākea o ka pōleʻa e hōʻoia i ka hahai ʻana i nā kūlana IPC Class II a i ʻole Class III, e like me nā koi ySMT Assembly Company.Hiki i nā ʻenehana loea ʻike ʻo SMT Assembly ke hoʻohana i nā kukui X 2D e hana i nā kiʻi 3D i mea e nānā ai i nā pilikia e like me ka haʻihaʻi ʻana o ka PCB vias, me Via ma Pad BGA Designs a me Blind / Buried Vias no nā ʻāpana o loko, e like me ka SMT Assembly Companyll ma ke ʻano o nā hui kūʻai anu. i nā kinipōpō BGA.