Shirkadda Golaha SMT waxa ay bixinaysay kulanka BGA, oo ay ku jiraan adeegyada BGA Rework iyo BGA reballing in industry Assembly Board Printed tan iyo 2003. Iyada oo casriga ah ee qalabka meelaynta BGA, hab-sax-sare BGA kulan kulanka, goynta- gees X- Qalabka Kormeerka Ray, iyo xalalka Golaha PCB oo dhameystiran oo si heer sare ah loo habeyn karo, waxaad nagu tiirsan kartaa si aan u dhisno guddiyada BGA tayo sare leh oo wax soo saar sare leh.
Awooda Golaha BGA
Shirkadda Golaha SMT waxay leedahay SMT Assembly Companyalth waayo-aragnimo u leh maaraynta dhammaan noocyada BGA-yada, oo ay ku jiraan DSBGA iyo Qaybaha kale ee Kakan, laga bilaabo BGA-yada yaryar (2mmX3mm) ilaa cabbirka weyn ee BGAs (45 mm);laga bilaabo BGA-yada dhoobada ilaa BGA-yada caaga ah.waxay awood u leeyihiin inay dhigaan ugu yaraan 0.4 mm garoonka BGA-yada ySMT Assembly Company PCB.
Nidaamka Golaha BGA/ profiles kulaylka
Heerarka kulaylka ayaa aad muhiim ugu ah BGA ee Geedi-socodka Golaha PCB.Kooxda wax soo saarka ee SMT Assembly waxay samayn doonaan DFM Check taxadar leh si ay dib ugu eegaan labada ySMT Assembly Company PCB faylalka iyo xaashida xogta BGA si ay u horumariyaan astaanta kulaylka ee ySMT Assembly Company BGA habka isu imaatinka.Shirkadda Golaha SMT waxay qaadan doontaa cabbirka BGA iyo ka kooban walxaha kubbadda BGA (hoggaanka ama Leedhka-free) iyadoo la tixgalinayo si loo sameeyo muuqaallada kulaylka waxtarka leh.
Marka cabbirka jireed ee BGA uu weyn yahay, Shirkadda Golaha SMT waxay wanaajin doontaa astaanta kulaylka si ay u dejiso kuleyliyaha gudaha BGA si ay uga hortagto bannaannada wadajirka ah iyo Cillaadaha kale ee Golaha PCB ee Guud.Shirkadda Golaha SMT waxay raacdaa IPC Class II ama Class III tilmaamaha Maareynta Tayada si loo hubiyo in wax kasta oo banaan ahi uu ka hooseeyo 25% wadarta dhexroorka kubbadda alxanka.BGA-yada aan macdanta "lead-ka lahayn" waxay mari doonaan heerkulbeeg gaar ah oo aan lahayn macdanta "lead" si looga fogaado dhibaatooyinka kubbadda furan ee ka dhalan kara heerkulka LoSMT Assembly Companyr;Dhanka kale, BGA-yada hogaanka ah waxay mari doonaan hannaan hogaamineed oo khaas ah si looga hortago heerkulka sare inuu keeno biin gaaban.Marka Shirkadda Golaha SMT ay hesho ySMT Assembly Company Turn-Key PCB Amarka, Shirkadda Golaha SMT waxay hubin doontaa naqshadaynta ySMT Assembly Company PCB si ay dib ugu eegto wixii tixgelin ah ee u gaarka ah qaybaha BGA inta lagu jiro SMT Assembly Company si taxadar leh DFM (Nashqada Wax Soo Saarka).
Xaqiijinta buuxda waxaa ka mid ah hubinta ku habboonaanta Walxaha Laminate ee PCB, Saamaynta Dhammaystirka Dusha sare, Shuruudaha ugu badan ee bogga dagaal iyo nadiifinta Maaskarada Alxan.Dhammaan arrimahan waxay saameeyaan tayada kulanka BGA.
Alxanka BGA, Dib-u-shaqaynta BGA & Ku Celinta
Waxa laga yaabaa inaad ku haysato dhawr BGA-yo ah ama qaybo qurxoon oo ku yaala ySMT Assembly Company boorarka kombuyuutarrada oo u baahan kulanka PCB ee samaynta R&D.Shirkadda Golaha SMT ayaa ku caawin karta - Shirkadda Golaha SMT waxay bixisa adeeg alxanka BGA oo khaas ah ujeedooyinka tijaabinta iyo qiimaynta iyada oo qayb ka ah Shirkadda Golaha SMT ee diiradda saaraysa Prototype PCB Assembly.
Intaa waxaa dheer, Shirkadda Golaha SMT waxay kaa caawin kartaa dib-u-shaqaynta BGA iyo ku-celinta BGA qiimo jaban!Shirkadda Golaha SMT waxay raacdaa shan tilaabo oo aasaasi ah si ay u qabato dib-u-shaqayn BGA: ka saarida qaybaha, diyaarinta goobta, arjiga koollada alxanka, beddelka BGA, iyo Alxanka Dib-u-socodka.Shirkadda Golaha SMT waxay dammaanad qaadaysaa in 100% boodhadhka Golaha ySMT ay si buuxda u shaqayn doonaan marka laguu soo celiyo.
Kormeerka X-ray ee Golaha BGA
Shirkadda Golaha SMT waxay isticmaashaa mashiinka X-ray si ay u ogaato cilladaha kala duwan ee dhici kara inta lagu jiro kulanka BGA.
Iyadoo loo marayo kormeerka raajada, Shirkadda Golaha SMT waxay baabi'in kartaa dhibaatooyinka alxanka ee looxa, sida Kubadaha Alxanka iyo Isku-xidhka koodhka.Sidoo kale, SMT Assembly Company Taageerada raajada software waxay xisaabin kartaa cabbirka farqiga kubbadda si loo hubiyo inay raacdo heerarka IPC Class II ama Class III, sida waafaqsan shuruudaha Shirkadda Golaha ySMT.Farsamayaqaannada Golaha SMT ee khibradda leh ayaa sidoo kale isticmaali kara 2D Raajo si ay u soo bandhigaan sawirrada 3D si ay u hubiyaan dhibaatooyinka sida PCB-ga jabay, oo ay ku jiraan Via in Pad BGA Designs iyo Indho la'aanta / Aasan Vias ee lakabyada gudaha, sida SMT Assembly Companyll sida kala-goysyada alxanka qabow. ee kubbadaha BGA.