Inkampani yeNdibano ye-SMT iye yabonelela ngendibano ye-BGA, kuquka ne-BGA Rework kunye ne-BGA Reballing iinkonzo kushishino lweNdibano yeBhodi yeSekethe eShicileleyo ukususela ngo-2003. Ngezixhobo zokubekwa kwe-BGA ezikumgangatho ophezulu, iinkqubo zendibano ze-BGA ezichanekileyo, ukusika X- izixhobo Ray Ukuhlolwa, kunye customizable kakhulu Gqibezela izisombululo PCB Assembly, ungathembela kuthi ukwakha umgangatho ophezulu kunye neebhodi isivuno eliphezulu BGA
Ubunakho beNdibano yeBGA
INkampani yeNdibano ye-SMT ineNkampani yeNdibano ye-SMT yamava okuphatha zonke iintlobo ze-BGA, kubandakanywa i-DSBGA kunye nezinye ii-Complex Components, ukusuka kwii-BGA ezincinci (2mmX3mm) ukuya kwii-BGAs ezinkulu (45 mm);ukusuka kwiiBGA zeceramic ukuya kwiiBGA zeplastiki.bayakwazi ukubeka ubuncinane be-0.4 mm pitch BGAs kwi-ySMT Assembly Company PCB.
Inkqubo yeNdibano ye-BGA/iiprofayili ze-Thermal
Iprofayili ye-Thermal ibaluleke kakhulu kwi-BGA kwiNkqubo yeNdibano ye-PCB.Iqela lemveliso ye-SMT Assembly Company liya kuqhuba uHlolo lwe-DFM ngocoselelo ukuphonononga zombini iifayile ze-ySMT Assembly Company PCB kunye nedatha yedatha ye-BGA ukuphuhlisa iprofayile yobushushu elungiselelwe inkqubo yendibano ye-ySMT Assembly Company BGA.INkampani yeNdibano ye-SMT iya kuthatha ubungakanani be-BGA kunye nokwakheka kwezinto zebhola ze-BGA (ekhokelayo okanye i-Lead-Free) ithathelwe ingqalelo ukwenza iiprofayili ezisebenzayo ze-thermal.
Xa ubukhulu bomzimba be-BGA inkulu, iNkampani yeNdibano ye-SMT iya kwandisa iprofayili ye-thermal ukuze ifakwe kwindawo yokufudumeza kwi-BGA yangaphakathi ukuthintela i-voids edibeneyo kunye nezinye iimpazamo zeNdibano ze-PCB eziqhelekileyo.INkampani yeNdibano ye-SMT ilandela i-IPC Class II okanye i-Class III yoLawulo loMgangatho woLawulo lweMigangatho ukuqinisekisa ukuba nayiphi na i-voids ingaphantsi kwe-25% ye-diameter yebhola ye-solder.Ii-BGA ezingakhokheli ziza kudlula kwiprofayili ye-thermal ekhethekileyo yokuthintela iingxaki zebhola ezivulekileyo ezinokubangelwa yi-loSMT Assembly Companyr amaqondo obushushu;kwelinye icala, ii-BGAs ezikhokelayo ziya kuhamba ngenkqubo ekhokelelweyo ekhethekileyo ukuthintela amaqondo obushushu aphezulu ukuba abangele iibhulukhwe ezimfutshane.Xa iNkampani yeNdibano ye-SMT ifumana i-ySMT Assembly Company Turn-Key PCB Assembly Order, i-SMT Assembly Company iya kujonga uyilo lwe-ySMT Assembly Company PCB ukuphonononga nayiphi na imiba ethile kumacandelo e-BGA ngexesha leNkampani yeNdibano ye-SMT ngocoselelo i-DFM (uYilo lokwenziwa kokwenziwa).
Ukuqinisekiswa okupheleleyo kubandakanya ukutshekishwa kokuhambelana kwe-PCB yeLaminate Material, i-Surface Finish effects, eyona mfuneko ye-warpage ephezulu kunye ne-Solder Mask clearance.Zonke ezi zinto zichaphazela umgangatho wendibano ye-BGA.
BGA soldering, BGA Rework & Reballing
Usenokuba nee-BGA ezimbalwa kuphela okanye iibhodi zePCB zeNkampani ye-ySMT ezifuna indibano ye-PCB ye-R&D prototyping.INkampani yeNdibano ye-SMT inokunceda - iNkampani yeNdibano ye-SMT inikezela ngenkonzo ekhethekileyo ye-BGA yokuthengisa ngeenjongo zokuvavanya nokuvavanya njengenxalenye ye-SMT Assembly Company igxile kwi-Prototype PCB Assembly.
Ukongeza, iNkampani yeNdibano ye-SMT inokukunceda nge-BGA rework kunye ne-BGA yokubuyisela ngexabiso elifikelelekayo!Inkampani yeNdibano ye-SMT ilandela amanyathelo amahlanu asisiseko ukwenza i-BGA rework: ukususwa kwecandelo, ukulungiswa kwendawo, isicelo sokunamathisela i-solder, ukutshintshwa kwe-BGA, kunye ne-Reflow Soldering.I-SMT Assembly Company iqinisekisa ukuba i-100% yeebhodi ze-ySMT Assembly Company ziya kusebenza ngokupheleleyo xa zibuyiselwa kuwe.
BGA iNdibano X-Ray Ukuhlolwa
Inkampani yeNdibano ye-SMT isebenzisa umatshini we-X-Ray ukubona iziphene ezahlukeneyo ezinokuthi zenzeke ngexesha lendibano ye-BGA.
Ngokuhlola i-X-reyi, iNkampani yeNdibano ye-SMT inokuphelisa iingxaki zokuthengisa ebhodini, njengeeBhola zeSolder kunye ne-Paste Bridging.Kwakhona, i-SMT Assembly Company X-Ray inkxaso software ingabala ubungakanani besithuba kwibhola ukuqinisekisa ukuba ilandela i-IPC Class Class II okanye iClass III imigangatho, ngokweemfuno ze-ySMT Assembly Company.I-SMT Assembly Company amagcisa anamava angasebenzisa i-X-ray ye-2D ukunika imifanekiso ye-3D ukwenzela ukujonga iingxaki ezinjengee-PCB ezaphukileyo, kuquka i-Via ePad i-BGA Designs kunye ne-Blind / i-Buried Vias ye-inner layers, njenge-SMT Assembly Companyll njengeendawo ezibandayo ze-solder. kwiibhola zeBGA.