I-SMT Assembly Company ibihlinzeka ngomhlangano we-BGA, okuhlanganisa i-BGA Rework kanye ne-BGA Reballing services embonini Yomhlangano Webhodi Lesifunda Ephrintiwe kusukela ngo-2003. Ngemishini yokubekwa ye-BGA yesimanjemanje, izinqubo zokuhlanganisa ze-BGA ezinembayo eziphezulu, i-X- Imishini yokuhlola iRay, kanye nezisombululo ze-Complete PCB Assembly ezenza ngezifiso kakhulu, ungathembela kithi ukuthi sakhe amabhodi e-BGA ekhwalithi ephezulu nesivuno esiphezulu.
Ikhono Lomhlangano we-BGA
I-SMT Assembly Company ine-SMT Assembly Companyalth yokuhlangenwe nakho yokuphatha zonke izinhlobo zama-BGA, okuhlanganisa i-DSBGA nezinye Izingxenye Eziyinkimbinkimbi, kusukela kuma-BGA amancane (2mmX3mm) kuya kuma-BGA osayizi abakhulu (45 mm);kusuka kuma-BGA e-ceramic kuya kuma-BGA epulasitiki.bayakwazi ukubeka ubuncane be-0.4 mm pitch BGAs ku-ySMT Assembly Company PCB.
Inqubo Yomhlangano we-BGA/Amaphrofayili ashisayo
Iphrofayili eshisayo ibaluleke kakhulu ku-BGA kuNqubo Yomhlangano we-PCB.Ithimba elikhiqizayo le-SMT Assembly Company lizohlola ngokucophelela i-DFM Check ukuze libuyekeze womabili amafayela e-ySMT Assembly Company PCB kanye nemininingwane yedatha ye-BGA ukuze kwakhiwe iphrofayili yokushisa ethuthukisiwe yenqubo yokuhlanganisa ye-ySMT Assembly Company BGA.I-SMT Assembly Company izocabangela usayizi we-BGA kanye nokwakheka kwebhola le-BGA (eliholayo noma Elingenamthofu) ukuze yenze amaphrofayili asebenzayo ashisayo.
Uma usayizi womzimba we-BGA mkhulu, Inkampani Yomhlangano we-SMT izothuthukisa iphrofayela eshisayo ukuze ifake ukushisisa okwasendaweni ku-BGA yangaphakathi ukuze kuvinjwe ama-voids ahlangene namanye Amaphutha Omhlangano Ovamile we-PCB.I-SMT Assembly Company ilandela i-IPC Class II noma imihlahlandlela Yokuphatha Ikhwalithi Yekilasi lesi-III ukuze iqinisekise ukuthi noma yiziphi izikhala zingaphansi kuka-25% wesamba sedayamitha yebhola le-solder.Ama-BGA angenawo umthofu azodlula kuphrofayili eshisayo engenamthofu ukuze agweme izinkinga zebhola ezivulekile ezingabangelwa amazinga okushisa e-loSMT Assembly Companyr;ngakolunye uhlangothi, ama-BGA aholayo azodlula kunqubo eyisipesheli eholayo ukuze avimbele amazinga okushisa aphezulu ukuthi angabangeli izikhindi zamaphini.Lapho i-SMT Assembly Company ithola i-oda le-ySMT Assembly Company Turn-Key PCB Assembly, I-SMT Assembly Company izohlola idizayini ye-ySMT Assembly Company PCB ukuze ibuyekeze noma yikuphi ukucatshangelwa okuqondene nezingxenye ze-BGA phakathi nokubuyekezwa kwe-SMT Assembly Company ngokucophelela kwe-DFM (Design for Manufacturability).
Ukuqinisekiswa okugcwele kufaka phakathi amasheke wokuhambisana kwe-PCB Laminate Material, imiphumela ye-Surface Finish, imfuneko enkulu yekhasi le-warge kanye nokuvunyelwa kwe-Solder Mask.Zonke lezi zici zithinta ikhwalithi yomhlangano we-BGA.
I-BGA soldering, i-BGA Rework & Reballing
Ungase ube nama-BGA ambalwa kuphela noma izingxenye ezinhle zephimbo kumabhodi e-PC ye-ySMT Assembly Company adinga ukuhlanganiswa kwe-PCB ye-R&D prototyping.I-SMT Assembly Company ingasiza - I-SMT Assembly Company inikeza isevisi ekhethekile yokudayisa ye-BGA ngezinjongo zokuhlola nokuhlola njengengxenye ye-SMT Assembly Company egxile ku-Prototype PCB Assembly.
Ukwengeza, i-SMT Assembly Company ingakusiza nge-BGA rework kanye ne-BGA reballing ngentengo efinyelelekayo!I-SMT Assembly Company ilandela izinyathelo ezinhlanu eziyisisekelo zokwenza kabusha i-BGA: ukususwa kwengxenye, ukulungiswa kwesayithi, isicelo sokunamathisela i-solder, ukushintshwa kwe-BGA, kanye ne-Reflow Soldering.I-SMT Assembly Company iqinisekisa ukuthi u-100% wamabhodi e-ySMT Assembly Company azosebenza ngokugcwele lapho ebuyiselwa kuwe.
I-BGA Assembly X-Ray Inspection
I-SMT Assembly Company isebenzisa umshini we-X-Ray ukuze ithole iziphambeko ezihlukahlukene ezingase zenzeke phakathi nokuhlanganiswa kwe-BGA.
Ngokuhlola i-X-ray, i-SMT Assembly Company ingaqeda izinkinga zokudayiswa ebhodini, njenge-Solder Balls kanye ne-Paste Bridging.Futhi, isofthiwe yosekelo ye-SMT Assembly Company X-Ray ingabala usayizi wegebe ebholeni ukuze iqinisekise ukuthi ilandela amazinga e-IPC Class II noma Class III, ngokwezimfuneko ze-ySMT Assembly Company.Ochwepheshe abanolwazi lwe-SMT Assembly Company bangaphinda basebenzise ama-X-ray angu-2D ukuze banikeze izithombe ze-3D ukuze bahlole izinkinga ezifana ne-PCB ephukile, okuhlanganisa i-Via in Pad BGA Designs kanye ne-Blind / Buried Vias yezingqimba zangaphakathi, njenge-SMT Assembly Companyll njengamajoyinti abandayo e-solder. kumabhola e-BGA.