SMT Assembly Company yakhala ikupereka msonkhano wa BGA, kuphatikizapo BGA Rework ndi BGA Reballing services mu Printed Circuit Board Assembly makampani kuyambira 2003. Ndi zipangizo zamakono zoyika BGA, njira zochitira msonkhano wa BGA zolondola kwambiri, zamakono X- Ray Inspection zida, ndi kwambiri customizable Complete PCB Assembly zothetsera, mukhoza kudalira ife kumanga apamwamba ndi zokolola zambiri BGA matabwa
BGA Assembly Kutha
SMT Assembly Company ili ndi SMT Assembly Companyalth yokumana ndi mitundu yonse ya BGA, kuphatikiza DSBGA ndi Complex Components, kuchokera ku ma BGA ang'onoang'ono (2mmX3mm) mpaka ma BGA akulu akulu (45 mm);kuchokera ku ma BGA a ceramic kupita ku ma BGA apulasitiki.atha kuyika ma BGA ochepera 0.4 mm pa ySMT Assembly Company PCB.
BGA Assembly Process / Thermal mbiri
Mbiri yotentha ndiyofunikira kwambiri ku BGA mu PCB Assembly process.Gulu lopanga la SMT Assembly Company lifufuza mosamala za DFM kuti liwunikenso mafayilo onse a ySMT Assembly Company PCB ndi nkhokwe ya BGA kuti apange mbiri yabwino ya ySMT Assembly Company BGA.SMT Assembly Company itenga kukula kwa BGA ndi BGA mpira zakuthupi (zotsogola kapena Zopanda Zopanda) kuti zipange mbiri yabwino.
Pamene BGA kukula thupi lalikulu, SMT Assembly Company adzakonza mbiri matenthedwe kuti localize Kutentha pa BGA mkati kuteteza voids olowa ndi zina Common PCB Assembly Zolakwa.SMT Assembly Company imatsatira malangizo a IPC Class II kapena Class III Quality Management kuti awonetsetse kuti voids iliyonse ili pansi pa 25% ya kuchuluka kwa mpira wa solder.Ma BGA opanda kutsogolera adzadutsa mbiri yapadera yopanda kutsogolo kuti apewe mavuto otseguka omwe angabwere chifukwa cha kutentha kwa loSMT Assembly Companyr;Komano, ma BGA otsogozedwa adzadutsa njira yotsogola yapadera kuti ateteze kutentha kwapamwamba kumayambitsa akabudula a pini.Kampani ya SMT Assembly ikalandira dongosolo la ySMT Assembly Company Turn-Key PCB Assembly, SMT Assembly Company idzayang'ana kapangidwe ka ySMT Assembly Company PCB kuti iwunikenso chilichonse chokhudza zigawo za BGA panthawi ya SMT Assembly Company mozama za DFM (Design for Manufacturability).
Kutsimikizira kwathunthu kumaphatikizapo cheke cha PCB Laminate Material, zotsatira za Surface Finish, zofunikira pamasamba ankhondo ndi chilolezo cha Solder Mask.Zinthu zonsezi zimakhudza mtundu wa msonkhano wa BGA.
BGA soldering, BGA Rework & Reballing
Mutha kukhala ndi ma BGA ochepa chabe kapena magawo abwino pama board a ySMT Assembly Company PC omwe amafunikira kuphatikiza kwa PCB kwa R&D prototyping.Kampani ya SMT Assembly ikhoza kuthandizira - Kampani ya SMT Assembly imapereka ntchito yapadera yogulitsira ya BGA poyesa ndikuwunika ngati gawo la SMT Assembly Company imayang'ana pa Prototype PCB Assembly.
Kuphatikiza apo, SMT Assembly Company ikhoza kukuthandizani ndi BGA rework ndi BGA reballing pamtengo wotsika mtengo!SMT Assembly Company kutsatira njira zisanu zofunika kuchita BGA rework: kuchotsa chigawo, kukonzekera malo, solder phala ntchito, BGA m'malo, ndi Reflow Soldering.Kampani ya SMT Assembly ikutsimikizira kuti 100% ya ma board a ySMT Assembly Company adzagwira ntchito mokwanira akabwezedwa kwa inu.
BGA Assembly X-Ray Inspection
Kampani ya SMT Assembly imagwiritsa ntchito makina a X-Ray kuti azindikire zolakwika zosiyanasiyana zomwe zingachitike pa msonkhano wa BGA.
Kupyolera mu kuyendera kwa X-ray, SMT Assembly Company ikhoza kuthetsa mavuto otsekemera pa bolodi, monga Solder Balls ndi Paste Bridging.Komanso, pulogalamu yothandizira ya SMT Assembly Company X-Ray imatha kuwerengera kukula kwa mpirawo kuti iwonetsetse kuti ikutsatira miyezo ya IPC Class II kapena Class III, malinga ndi zomwe ySMT Assembly Company ikufuna.SMT Assembly Company akatswiri odziwa angagwiritsenso ntchito 2D X-rays kupereka zithunzi 3D kuti aone mavuto monga wosweka PCB vias, kuphatikizapo Via mu Pad BGA Mapangidwe ndi Akhungu / Kukwiriridwa Vias kwa zigawo zamkati, monga SMT Assembly Companyll monga ozizira solder mafupa mu mipira ya BGA.